Stacked Memory Die Access Using Master-Slave Data Combining

The patent combines separate command and data channels into a unified stacked memory dice architecture where command and data paths are integrated through shared interconnect structures. Multiple memory dice are stacked with interconnect layers that enable simultaneous command routing and data transfer across dice boundaries, allowing parallel operation of previously sequential channels.

The patent transitions from planar 2D memory organization to 3D stacked architecture. By stacking memory dice vertically and implementing interconnect layers between dice, the system adds a vertical dimension to data and command paths. This enables multiple command and data channels to operate simultaneously in different spatial layers, reducing access time while maintaining control independence through dedicated routing paths.

The patent segments the memory system into discrete dice stacked vertically, with each die containing independent memory arrays. Command and data paths are segmented into dedicated channels that route through specific interconnect layers. This segmentation allows the controller to address individual dice or groups of dice independently, managing access complexity through modular organization rather than monolithic structure.

The patent introduces interconnect layers as intermediary structures between stacked memory dice. These interconnect layers provide standardized routing interfaces that simplify complex inter-die communication. The interconnects act as mediators that manage signal routing, timing, and protocol conversion between dice, reducing access complexity by abstracting the underlying physical complexity into standardized interface operations.