Stacked Memory Package With Millimeter Wave Antenna in Die Stack
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Solution Overview
Problem
The integration of millimeter wave antennas into compact mobile devices is hindered by their size and potential interference with adjacent circuitry, limiting device density and mobility.
Innovation Solution
A stacked semiconductor device assembly with a millimeter wave antenna structure, where the antenna is positioned vertically along the edge of a semiconductor device stack, utilizing through-silicon vias and a stack interconnect structure, such as a ball-grid-array, to reduce horizontal space usage and minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If millimeter wave antennas are deposited on a printed circuit board within a mobile device, then millimeter wave communication capability is achieved, but the area occupied by the antennas decreases device density and increases device size
Solution Approach 1:
The patent transitions the antenna from a two-dimensional planar structure on the PCB to a three-dimensional vertical structure using stacked semiconductor dies. The antenna elements are arranged vertically through multiple layers, utilizing the z-dimension to reduce the horizontal footprint on the PCB while maintaining full millimeter wave communication capability.
2Adaptability or versatility
If horizontal millimeter wave antennas are deposited on the PCB, then millimeter wave communication is enabled, but interference is caused to adjacent circuitry
Solution Approach 1:
By stacking antenna elements vertically across multiple semiconductor die layers, the patent separates the antenna structure from adjacent PCB circuitry in the horizontal plane. This vertical arrangement reduces electromagnetic coupling and interference with neighboring circuits while preserving millimeter wave transmission and reception functions.
3Area of moving object
If compact wireless computing devices are made smaller and more mobile, then device mobility is improved, but processing and memory packages must become more densely integrated
Solution Approach 1:
The patent combines multiple functions into a single integrated antenna structure formed across stacked semiconductor die. The antenna incorporates both radiating elements and interconnect structures within the same three-dimensional formation, eliminating the need for separate antenna components and reducing overall device complexity while enabling compact form factor.
Data Source
AI summary
A stacked semiconductor device assembly may include a first semiconductor device having a first substrate and a first set of vias through the first substrate. The first set of vias may define a first portion of an antenna structure. The stacked semiconductor device assembly may further include a second semiconductor device having a second substrate and a second set of vias through the second substrate. The second set of vias may define a second portion of the antenna structure. The stacked semiconductor device assembly may also include a stack interconnect structure electrically coupling the first portion of the antenna structure to the second portion of the antenna.