Stacked Memory Die Write Allocation for Thermal Hotspot Control
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Solution Overview
Problem
Thermal management in stacked memory dies during write operations is challenging due to varying thermal profiles of different memory technologies, leading to potential reliability issues and performance degradation.
Innovation Solution
A system and method that manage thermal dissipation by maintaining memory block and die states, selecting open memory blocks based on relative distances to optimize thermal dissipation, and updating states to prevent overheating, using a processing component to initiate write operations across multiple memory dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If write operations are performed on multiple memory blocks simultaneously to increase productivity, then data storage throughput is improved, but thermal hotspots are generated leading to reliability degradation
Solution Approach 1:
The patent applies local quality by differentiating the operational state of different memory blocks based on their thermal conditions. Memory blocks are categorized into open state (allowing write operations) and closed state (preventing write operations) based on their relative distances to previously written blocks. This localized state management ensures that write operations are distributed to avoid thermal hotspots while maintaining overall productivity
Solution Approach 2:
The patent implements dynamics by making the memory block state (open/closed) changeable based on thermal conditions and write operation history. The processing component dynamically updates block states during operation, transitioning blocks from open to closed state after write operations, and potentially reopening them after refresh operations. This dynamic adaptation allows the system to balance throughput and reliability in real-time
2Productivity
If memory blocks are kept in open state to allow continuous write operations, then productivity is improved, but thermal accumulation occurs causing harmful effects
Solution Approach 1:
The patent applies periodic action by implementing a pattern of write operations followed by state transitions. After write operations on a memory block, the block transitions to closed state, creating a periodic cycle of open-write-closed states. This periodic state management prevents continuous thermal accumulation while maintaining productive write operation cycles
Solution Approach 2:
The patent implements preliminary anti-action by proactively closing memory blocks before thermal damage can occur. The processing component monitors and manages block states to prevent thermal accumulation by transitioning blocks to closed state after write operations, thereby preemptively counteracting the harmful thermal effects before they compromise reliability
Data Source
AI summary
Systems for managing thermal dissipation in multi-stacked memory dies, and methods and computer-readable storage media related thereto, are provided. The system includes memory dies including memory blocks to store data. A processing component is configured to maintain memory block states for the memory blocks. The memory block states include: an open memory block state allowing write operations, and a closed memory block state preventing write operations. The processing component is further configured to: receive a first write command to store first data, and compute first relative distances between open memory blocks in the open memory block state. The processing component is further configured to: select a set of open memory blocks for a first write operation based on the first relative distances so as to manage thermal dissipation, and initiate the first write operation on the first set of open memory blocks.