Stacked Mixed-Bandwidth Memory Dies for Thermal Load Distribution
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Solution Overview
Problem
Conventional 3D memory devices with mixed-bandwidth memory dies face challenges such as concentrated power consumption and heat management issues due to higher bandwidth dies, which can lead to poor heat distribution and strain on the power delivery network.
Innovation Solution
The implementation of mixed-bandwidth memory dies, where channels on each die are configured to operate in either a first or second bandwidth mode, dispersing higher-bandwidth channels across more dies to reduce power consumption hotspots and improve heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If higher bandwidth memory dies are used to increase data transfer speed, then read/write speeds are improved, but power consumption becomes concentrated and heat management becomes difficult
Solution Approach 1:
The patent segments the memory device into multiple stacks, with each stack containing a subset of memory dies. By distributing higher bandwidth dies across different stacks rather than concentrating them in one location, the power consumption and heat generation are divided and dispersed across multiple physical locations. This segmentation allows each stack to handle a portion of the total bandwidth demand, preventing any single location from becoming a thermal hotspot.
Solution Approach 2:
The patent introduces a vertical stacking dimension to distribute memory dies spatially. Instead of arranging all higher bandwidth dies in a single planar layer or contiguous region, the invention utilizes multiple vertical stacks arranged in three-dimensional space. This dimensional distribution separates the heat-generating components across different vertical and horizontal positions, improving thermal management while maintaining high bandwidth capabilities.
2Speed
If higher bandwidth memory dies are used to increase data transfer speed, then read/write speeds are improved, but strain on power delivery network increases
Solution Approach 1:
The memory device is divided into multiple independent stacks, each with its own power delivery pathways. By distributing higher bandwidth dies across different stacks, the power consumption demand is segmented and routed through multiple power delivery networks rather than overloading a single network. This segmentation reduces the strain on any individual power delivery path while collectively supporting the total bandwidth requirement.
Solution Approach 2:
The invention utilizes vertical stacking to create multiple power delivery tiers. Each stack has dedicated power delivery networks that operate independently, allowing power to be delivered to higher bandwidth dies through multiple vertical pathways. This multi-dimensional power distribution architecture reduces the strain on any single power delivery network by spreading the load across multiple vertical and horizontal power paths.
Data Source
AI summary
A memory device is provided. The memory device includes a plurality of memory dies positioned in a stack, the stack including a first set of memory dies and a second set of memory dies. Each die in the first set includes a first plurality of channels in a first configuration that includes channels configured to operate in a first bandwidth mode and channels configured to operate in a second bandwidth mode. Each die in the second set includes a second plurality of channels in a second configuration that includes channels configured to operate in the second bandwidth mode.