Stacked MEMS Sensing Structure for Compact Angular Velocity Detection
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Solution Overview
Problem
The challenge in MEMS device fabrication is the reduction in performance due to reduced contact area and size of inertial sensors, leading to decreased sensitivity and accuracy in angular velocity detection.
Innovation Solution
A MEMS device design involving multiple stacked device structure layers and conductive layers forming movable structures, with comb-like structures arranged to increase sensing area and form parallel-plate capacitors, allowing for enhanced angular velocity detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the inertial sensor is reduced, then the manufacturing cost is reduced, but the contact area of the movable structure is reduced leading to decreased performance
Solution Approach 1:
The patent transitions from a planar single-layer structure to a three-dimensional multi-layer stacked structure. Multiple device structure layers are stacked in the vertical direction (perpendicular to the silicon substrate surface) to form multiple movable structures, effectively utilizing the third dimension to increase sensing area without increasing the device footprint, thus resolving the contradiction between size reduction and performance maintenance.
Solution Approach 2:
The patent divides the sensing structure into multiple discrete device structure layers, each forming independent movable structures. This segmentation allows each layer to contribute to the overall sensing capability, increasing the total contact area and sensitivity while maintaining a compact form factor.
2Measurement precision
If multiple device structure layers are stacked to increase sensing area, then sensitivity and accuracy are improved, but device complexity increases
Solution Approach 1:
The patent employs identical or similar device structure layers that can be repeatedly stacked, with each layer performing the same sensing function. This modular approach increases sensing area and sensitivity while managing complexity through repetition of proven design units rather than creating entirely new complex structures.
Solution Approach 2:
Multiple device structure layers are merged into a single integrated stacked assembly, with conductive layers connecting adjacent device structure layers to form unified electrical paths. This merging consolidates multiple sensing elements into one compact structure, improving sensitivity while containing complexity within a standardized multi-layer architecture.
3Measurement precision
If comb-like structures are used to form parallel-plate capacitors, then angular velocity detection accuracy is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent extracts the critical sensing function into dedicated comb-like electrode structures within each device structure layer. By isolating this function into specific patterned conductive regions, the design achieves high detection accuracy while allowing standard semiconductor fabrication processes to handle the precision requirements through repeated patterning of identical structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases the sensitivity and accuracy of angular velocity detection while reducing the size and manufacturing cost of the MEMS device, suitable for integration into portable applications.
Implementation Method 1
each two adjacent device structure layers of the at least two device structure layers are coupled via a corresponding conductive structure layer to form electrical paths between the each two adjacent device structure layers and the corresponding conductive structure layer
Implementation Method 2
comb-like structures arranged to increase sensing area and form parallel-plate capacitors, allowing for enhanced angular velocity detection
Data Source
AI summary
A MEMS device and a method for manufacturing the MEMS device are provided. The MEMS device includes a cap sheet and a device sheet. The device sheet includes a silicon substrate, at least two device structure layers, and at least one conductive structure layer, and each two adjacent device structure layers are coupled via a corresponding conductive structure layer. The device sheet defines a functional cavity having a first region, a second region, and a third region. The at least two device structure layers and the at least one conductive structure layer each are across the first region, the second region, and the third region, and the at least two device structure layers and the at least one conductive structure layer cooperatively form a first movable structure in the first region, define an anchor point in the second region, and form a second movable structure in the third region.