Stacked Metal Block Circuit Board for 5G Heat Dissipation
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Solution Overview
Problem
Existing circuit boards struggle to effectively dissipate heat generated by complex transmit/receive designs in advanced communication products like 5G or 6G due to insufficient heat dissipation capabilities.
Innovation Solution
A circuit board design featuring stacked metal blocks that form vertical heat dissipation paths, with wider metal blocks connected to narrower ones, enhancing heat dissipation through a fan-shaped structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If complex transmit/receive designs are used in 5G or 6G communication products, then communication functionality is improved, but heat generation increases
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments by stacking several metal blocks (first metal block, second metal block, third metal block) at different locations on the circuit board. Each metal block serves as an independent heat dissipation unit, allowing heat from different electronic components to be dissipated separately and efficiently.
Solution Approach 2:
The patent transitions from traditional planar heat dissipation to three-dimensional vertical heat dissipation by stacking metal blocks at different heights and layers. The metal blocks extend across multiple wiring layers and are connected through conductive materials, creating vertical heat dissipation paths that utilize the third dimension (height) to improve thermal management.
2Temperature
If metal blocks are stacked vertically to improve heat dissipation, then heat dissipation effect is improved, but device complexity increases
Solution Approach 1:
The metal blocks serve multiple functions simultaneously: they provide heat dissipation for electronic components, act as structural support elements, and serve as electrical connection points through the conductive materials. The wiring layers and conductive materials also serve dual purposes of electrical connectivity and thermal conduction.
Solution Approach 2:
The patent merges the heat dissipation function with the existing circuit board structure by integrating metal blocks into the wiring substrate. The metal blocks are combined with wiring layers and conductive materials to form a unified multi-functional structure that performs both electrical and thermal functions.
3Temperature
If multiple wiring layers and metal blocks are integrated, then heat dissipation paths are improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary actions in the manufacturing process by pre-forming grooves in the wiring substrate, pre-positioning metal blocks in specific locations, and pre-establishing conductive material pathways before final assembly. The wiring layers are constructed with predetermined patterns that facilitate subsequent metal block integration.
Solution Approach 2:
The patent implements a nested structure where metal blocks are embedded within grooves of the wiring substrate, and conductive materials are nested between different metal blocks and wiring layers. The third metal block is positioned in a groove that exposes portions of the first metal block, creating a nested arrangement that optimizes space utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The stacked metal block configuration improves heat dissipation efficiency by creating effective pathways for heat dissipation from electronic components, even in densely packed circuit boards.
Implementation Method 1
the first conductive material electrically connects the first metal block and the second metal block
Implementation Method 2
backsides of electronic components can achieve the heat dissipation effect through these metal blocks. Since the electronic components (for example, chips) and these metal blocks are stacked and aligned vertically, good heat dissipation paths are formed
Data Source
AI summary
A circuit board includes a first external wiring layer, a second external wiring layer, a first internal structure, and a second internal structure. The first internal structure and the second internal structure are disposed between the first external wiring layer and the second external wiring layer. The first internal structure includes a first metal block extending from the first external wiring layer to the second internal structure. The second internal structure includes a second metal block, a high-frequency substrate, and a first conductive material. The second metal block penetrates through the high-frequency substrate. The first conductive material is disposed on the first metal block, in which the second metal block extends from the second external wiring layer to the first conductive material, and the first conductive material electrically connects the first metal block and the second metal block.