Stacked Metal Plate Electronic Device for Compact Wiring
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Solution Overview
Problem
Existing electronic devices with multiple components mounted on a lead frame tend to increase in size due to the arrangement of components next to each other, leading to space inefficiencies and potential electrical and thermal connectivity issues.
Innovation Solution
The electronic device design incorporates a first metal plate with wirings and an electronic component mounted on its lower surface, a second metal plate with electrodes electrically connected to the first metal plate, and an insulation layer filling the spaces between these components, allowing for a stacked configuration that reduces the device's size and enhances electrical and thermal connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electronic components are arranged next to one another on the lead frame, then the device can accommodate multiple components, but the size of the electronic device increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of electronic components to a three-dimensional stacked configuration. Multiple electronic components are mounted on different metal plates that are stacked vertically, with wiring extending between layers. This dimensional change allows multiple components to be accommodated within a smaller planar footprint while maintaining electrical connectivity through vertical wiring paths.
Solution Approach 2:
The patent implements a nested structure where multiple metal plates with electronic components are stacked and integrated within a compact volume. The wiring system nests through the layers, connecting components across different levels. This nesting approach enables high component density without increasing the overall device footprint.
2Reliability
If electronic components are arranged next to one another, then connectivity can be established, but wiring length increases leading to electrical property degradation
Solution Approach 1:
The wiring system extends in the vertical dimension between stacked metal plates, creating direct short-distance electrical paths between adjacent components. This eliminates the need for long lateral wiring routes, reducing parasitic inductance and resistance while improving signal integrity and electrical reliability.
3Device complexity
If electronic components are arranged next to one another, then the device structure is simple, but heat dissipation becomes difficult
Solution Approach 1:
The stacked metal plate configuration creates multiple vertical surfaces and interfaces that facilitate heat dissipation. Heat can escape through the vertical stacking architecture and through the wiring paths that extend between layers, providing additional thermal conduction pathways without requiring complex active cooling systems.
Data Source
AI summary
An electronic device includes a first metal plate including a first wiring and a second wiring, an electronic component mounted on a lower surface of the first wiring so as to overlap the second wiring in plan view, a second metal plate including an electrode electrically connected to the lower surface of the first wiring, and an insulation layer filling a space between the first metal plate, the second metal plate, and the electronic component and covering the electronic component. The upper surface of the second wiring is exposed from the insulation layer.