Stacked Metal Recess Structure for RF Shielding and Heat Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing component carriers face challenges in efficiently managing heat removal, electromagnetic interference, and signal quality, particularly in RF applications, while maintaining mechanical robustness and design flexibility.
Innovation Solution
A metal structure with aligned and misaligned recesses formed by etching on stacked metal layers, providing a common recess for efficient heat management, electromagnetic shielding, and RF functionality, such as waveguides, with high design flexibility and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional metallization processes are used to manufacture RF structures such as waveguides, then the structures can be formed, but the manufacturing cost increases and design flexibility is limited
Solution Approach 1:
The invention divides the waveguide structure into multiple separate metal layer structures (first metal layer structure, second metal layer structure, third metal layer structure) that are stacked and connected. Each layer can be manufactured independently with standard PCB processes, then assembled to form the complete 3D waveguide structure. This segmentation enables cost-effective manufacturing while maintaining design flexibility.
Solution Approach 2:
The invention transitions from conventional 2D planar metallization to a 3D stacked architecture. By utilizing the vertical dimension through multiple stacked metal layers connected by conductive vias, the patent achieves complex waveguide geometries that would be difficult or expensive to manufacture using traditional single-plane metallization methods.
2Productivity
If electronic components are miniaturized and densely packed on component carriers, then product functionality increases, but heat removal becomes increasingly difficult
Solution Approach 1:
The invention incorporates dedicated thermal management features integrated into the metal layer structures, including heat sinks and thermal vias positioned at specific locations where heat generation occurs. These localized thermal management elements provide targeted heat removal without requiring changes to the overall component layout or density.
3Productivity
If electronic components are miniaturized with smaller spacing, then component density increases, but electromagnetic interference protection becomes increasingly challenging
Solution Approach 1:
The invention implements nested shielding structures where metal layers are stacked and interconnected to form enclosed or partially enclosed spaces. The first, second, and third metal layer structures are positioned at different heights and connected through conductive vias, creating a nested configuration that provides electromagnetic shielding for sensitive components while maintaining high component density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal structure enhances thermal management, reduces electromagnetic interference, and improves signal quality, offering a robust and cost-effective solution for RF applications with reduced signal losses and increased design flexibility.
Implementation Method 1
a method of forming a metal structure for a component carrier, the method comprising: i) removing material, in particular by etching, of a first metal layer structure to form a first recess
Data Source
Figure 1~5
Figure 6~8
Figure 9~10
AI summary
There is described a metal structure (100) for a component carrier (150), wherein the metal structure (100) comprises: i) a first metal layer structure (110) comprising a first recess (111) exposed to a first surface and defining a first external boundary profile (115); and ii) a second metal layer structure (120) comprising a second recess (121) exposed to a second surface and defining a second external boundary profile (125). The first metal layer structure (110) and the second metal layer structure (120) are stacked to face each other, so that the first recess (111) and the second recess (121) define a common recess (130), and the first external boundary profile (115) of the first recess (111) and the second external boundary profile (125) of the second recess (121) are misaligned in the stacking direction (Z) of the metal structure (100).