Stacked Metal Recess Structure for RF Waveguide Component Carriers
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Solution Overview
Problem
The increasing miniaturization and functionality of component carriers, particularly in RF applications, pose challenges in heat removal, electromagnetic interference protection, mechanical robustness, and design flexibility, especially for waveguide antennas.
Innovation Solution
A metal structure with aligned and misaligned recesses in stacked metal layers, formed through etching, is used to create a common recess for efficient waveguides and electromagnetic shielding, allowing for thermal management and reliable RF functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional metallization processes are used to manufacture RF structures like waveguides, then the structures can be formed, but the manufacturing cost increases and design flexibility is limited
Solution Approach 1:
The waveguide structure is divided into multiple separate metal layers (first metal layer structure and second metal layer structure) that are stacked and aligned. Each layer can be manufactured independently with recesses formed by etching, allowing for modular assembly and reduced manufacturing complexity while maintaining design flexibility.
Solution Approach 2:
The invention transitions from conventional planar metallization to a three-dimensional stacked metal layer structure. By forming recesses in multiple stacked metal layers and aligning them vertically, the patent creates waveguide structures that utilize the vertical dimension, enabling complex 3D RF structures with improved design flexibility and reduced manufacturing costs.
2Productivity
If electronic components are miniaturized and densely packed, then product functionality increases, but heat removal becomes increasingly difficult
Solution Approach 1:
The metal layers are configured with specific local properties - continuous metal structures and recesses that create thermal pathways. The stacked metal layer structure provides localized thermal management zones that can conduct heat away from dense electronic component areas without interfering with the miniaturized component layout.
3Productivity
If electronic components are miniaturized with smaller contact spacing, then component density increases, but electromagnetic interference protection becomes increasingly critical
Solution Approach 1:
The stacked metal layer structure serves multiple functions simultaneously: it forms RF waveguide structures for signal transmission, provides electromagnetic shielding through continuous metal layers, and enables thermal management. This multi-functional structure protects miniaturized components from EMI while maintaining high component density.
Solution Approach 2:
The invention uses composite structures combining multiple metal layers with different configurations - some layers provide shielding continuity while others form waveguide recesses. This composite metal layer arrangement creates effective electromagnetic shielding for dense component layouts without sacrificing component density.
4Strength
If component carriers must be mechanically robust under harsh conditions, then structural strength increases, but design flexibility for RF applications decreases
Solution Approach 1:
The waveguide structure is segmented into multiple robust metal layers that can be independently manufactured and then assembled. Each metal layer maintains structural integrity, and the stacked configuration provides overall mechanical robustness while the modular nature allows for RF design flexibility through various alignment and configuration options.
Data Source
AI summary
A metal structure for a component carrier includes a first metal layer structure having a first recess exposed to a first surface and defining a first external boundary profile; and a second metal layer structure having a second recess exposed to a second surface and defining a second external boundary profile. The first metal layer structure and the second metal layer structure are stacked to face each other, so that the first recess and the second recess define a common recess, and the first external boundary profile of the first recess and the second external boundary profile of the second recess are misaligned in the stacking direction of the metal structure.