Stacked Micro Display Driver and Pixel Array Chips

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Solution Overview

Problem

Conventional micro display devices face challenges in reducing size and manufacturing cost while maintaining high resolution and yield, especially for small display devices like virtual reality and augmented reality devices, due to the increasing size of chips required for larger screens and higher resolutions.

Innovation Solution

The design incorporates a pixel array chip and a driver chip with through-electrodes connecting gate and data lines, allowing for a separate implementation of the pixel array and driver circuits on silicon substrates, reducing spatial constraints and enabling smaller, more cost-effective manufacturing by separating the pixel array and circuit zones.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the chip size is increased to achieve larger screen and higher resolution, then the display performance is improved, but the production yield is lowered and manufacturing cost increases

Engineering Contradiction:
ImproveresolutionVSAvoidproduction yield
Core Design Contradiction:
Measurement precisionVSProductivity

Solution Approach 1:

The display device is divided into two separate chips: a pixel array chip containing only the pixel array, and a driver chip containing the driver circuits. This segmentation allows each chip to be manufactured independently at optimal sizes, enabling high-resolution pixel arrays to be produced with high yield while keeping driver circuits on a separate chip.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If the chip size is increased to achieve larger screen and higher resolution, then the display performance is improved, but the manufacturing cost increases

Engineering Contradiction:
ImproveresolutionVSAvoidmanufacturing cost
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

By segmenting the display device into pixel array chip and driver chip, each component can be manufactured independently using optimized processes. The pixel array chip can be produced at high volume with standard semiconductor processes, while the driver chip can be manufactured separately, reducing overall manufacturing cost for high-resolution displays.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Through-electrodes are introduced as intermediary connection elements that bridge the pixel array chip and driver chip. These through-electrodes enable electrical connection between the two separately manufactured chips, allowing high-resolution pixel arrays to be connected to driver circuits without requiring a single large expensive chip.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If all components are integrated on a single chip, then the device structure is simplified, but the spatial constraints increase and manufacturing flexibility decreases

Engineering Contradiction:
Improvedevice structureVSAvoidchip area
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The display device is segmented into two functional chips mounted in close proximity. The pixel array chip and driver chip are positioned adjacent to each other and connected through through-electrodes, achieving compact integration without requiring a single large chip, thus reducing spatial constraints while maintaining functional integration.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10839756B2Micro display device and display integrated circuit having dual chips stacked with each other
Publication Date: 2020.11.17 LG DISPLAY CO LTD
  • US10839756B2 patent drawing
  • US10839756B2 patent drawing
  • US10839756B2 patent drawing

AI summary

Embodiments of the present disclosure relate to a micro display device and a display integrated circuit and, more specifically, to a micro display device and a display integrated circuit, which include: a pixel array chip including a pixel array zone in which a plurality of subpixels defined by a plurality of gate lines and a plurality of data lines are arranged, and a through-zone in which a plurality of through-electrodes connected to the plurality of gate lines and the plurality of data lines in an outer area of the pixel array zone are arranged; and a driver chip including a circuit zone in which a driver circuit configured to drive the plurality of gate lines and the plurality of data lines through the plurality of through-electrodes is disposed, and thus have a high yield.