Vertically Stacked Micro LED Structure for Compact Wiring
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Solution Overview
Problem
Existing LED technologies require a large number of wires and a complex circuit layout due to LEDs and driving devices being on different layers, leading to a bulky light-emitting module structure.
Innovation Solution
A micro LED is designed with a vertically stacked structure comprising a substrate, conductive layer, and light-emitting assembly, utilizing conductive bumps for electrical connection between electrodes of stacked semiconductors, reducing the number of wires and overall size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple LEDs are arranged in a light-emitting module to achieve sufficient luminance, then the required luminance is met, but the number of wires and circuit complexity increase significantly
Solution Approach 1:
Multiple light-emitting semiconductor chips are integrated onto a single substrate to form a light-emitting assembly, merging multiple discrete LED components into one unified structure. This reduces the number of separate wire connections needed while maintaining the required total luminance output.
Solution Approach 2:
The patent transitions from a planar arrangement of LEDs to a three-dimensional stacked configuration where light-emitting semiconductors are positioned at different vertical levels on the substrate. This vertical stacking reduces the horizontal footprint and simplifies wire routing by utilizing the Z-axis dimension.
2Illumination intensity
If multiple LEDs are used to achieve sufficient luminance, then the required luminance is met, but the overall volume of the light-emitting module increases
Solution Approach 1:
Light-emitting semiconductor chips are nested vertically on the substrate like nested dolls, with multiple chips stacked at different heights. This nesting arrangement allows multiple light-emitting elements to occupy a compact vertical space rather than spreading out horizontally, significantly reducing the overall module volume.
Solution Approach 2:
The design exploits the vertical dimension by stacking light-emitting semiconductors at different heights on the substrate. This transforms a two-dimensional planar layout into a three-dimensional stacked structure, achieving high luminance within a smaller footprint volume.
3Reliability
If wires are routed between LEDs and driving devices on different layers, then electrical connection is achieved, but the number of drilling holes and manufacturing complexity increase
Solution Approach 1:
The substrate serves multiple functions simultaneously: it acts as the mounting platform for light-emitting semiconductors, provides electrical interconnection between components, and serves as the structural base for the entire light-emitting assembly. This multi-functionality eliminates the need for separate wire routing and drilling operations.
Solution Approach 2:
The electrical connection function is merged into the substrate itself through integrated conductive structures. Instead of requiring separate wire connections and drilling holes through the substrate, the conductive pathways are built into the substrate, simplifying the manufacturing process while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vertically stacked structure halves the number of wires and reduces the overall volume of the LED module, enabling efficient and compact lighting solutions.
Implementation Method 1
When a current flows through a semiconductor LED, it emits light. Being a light-emitting semiconductor device enabled by electricity, when electrons and holes recombine therein, the energy will be released in the form of photons.
Data Source
AI summary
The present invention provides a micro light-emitting diode (LED). A conductive layer is disposed on a substrate. A light-emitting assembly is disposed on the conductive layer. A first light-emitting semiconductor and a second light-emitting semiconductor of the light-emitting assembly are stacked vertically. A first conductive bump and a second conductive bump of a conductive bump set electrical conduct the first light-emitting semiconductor and the second light-emitting semiconductor. Thereby, the volume of the micro LED can be shrunk.