Stacked Micro Optocouplers Volume Reduction
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Solution Overview
Problem
The bulky size and high cost of individual optocouplers in power conversion circuits hinder miniaturization and increase manufacturing costs, while existing optocouplers struggle to improve electrical performance due to lengthy wirebonds and complex assembly processes.
Innovation Solution
The integration of two or more optocouplers on separate sides of a substrate with optically transmissive material and molding, allowing for a smaller package size and simplified manufacturing by eliminating the need for temporary supports and reducing wirebond lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple optocouplers are packaged individually, then each optocoupler can be manufactured with standard processes, but the overall package size and volume become bulky and large
Solution Approach 1:
The patent combines multiple optocoupler devices into a single integrated package containing multiple independently operable optocoupler circuits. Each optocoupler includes an emitter device, receiver device, and optical coupling medium, all integrated on one substrate. This merging approach reduces the overall package volume by eliminating redundant packaging structures while maintaining individual functionality of each optocoupler channel.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional vertical stacking of optocoupler devices. Multiple optocoupler circuits are arranged in layers above and below a central substrate, utilizing the vertical dimension to pack more devices into a smaller footprint. This dimensional change dramatically reduces package volume while maintaining ease of manufacture through standardized assembly processes.
2Ease of manufacture
If traditional optocoupler packaging is used, then manufacturing is simpler with fewer integration steps, but wirebond lengths become lengthy and electrical performance deteriorates
Solution Approach 1:
The patent segments the optocoupler package into distinct functional layers: emitter devices on one side of the substrate, receiver devices on the other side, with optical coupling media positioned between them. This segmentation allows for optimized wirebond routing within each layer, significantly reducing wirebond lengths compared to traditional packaging where all components are arranged in a single plane. The segmented architecture maintains manufacturing simplicity through modular assembly while improving electrical performance.
3Productivity
If more optocouplers are integrated into a single package, then manufacturing costs per unit decrease and space is saved, but the device complexity and assembly process become more complex
Solution Approach 1:
The patent creates a universal optocoupler package structure that can accommodate multiple independently operable optocoupler circuits using the same emitter-receiver-optical medium configuration. Each optocoupler channel follows the same architectural pattern, allowing standardized manufacturing processes to be replicated across multiple channels. This universality reduces per-unit manufacturing costs and simplifies assembly despite integrating multiple devices, as the same tools and procedures can be used for each optocoupler channel.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a 30-40% reduction in package volume, lower material costs, improved electrical performance, and reduced manufacturing time and costs, while maintaining optical isolation and enabling shorter, more reliable wirebonds.
Implementation Method 1
an optical emitter device that is optically coupled to an optical receiver device through an optically transmissive medium. This arrangement permits the passage of information from one electrical circuit that contains the optical emitter device to another electrical circuit that contains the optical receiver device
Data Source
AI summary
Disclosed are packages for optocouplers and methods of making the same. An exemplary optocoupler comprises a substrate having a first surface and a second surface, a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's first surface, and a plurality of optoelectronic dice for one or more optocouplers disposed on the substrate's second surface. The substrate may comprise a pre-molded leadframe, and electrical connections between optoelectronic dice on opposite surfaces of the substrate may be made via one or more leads of the leadframe.