Stacked Semiconductor Microcooler with Liquid-Cooled Fin Trenches
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Solution Overview
Problem
As electronic devices become smaller but more powerful, they generate increased heat that existing cooling methods struggle to efficiently manage, particularly in densely packed systems where passive cooling is insufficient.
Innovation Solution
A liquid cooling system utilizing stacked semiconductor microcoolers with silicon fins and copper layers, where liquid coolant flows through fin trenches to enhance heat transfer, increasing the surface area for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If passive cooling methods are used, then device simplicity is maintained, but heat dissipation efficiency is insufficient for high-power devices
Solution Approach 1:
The patent employs liquid coolant flowing through channels to actively remove heat from the semiconductor device, replacing passive cooling methods with hydraulic-based active cooling to achieve superior heat dissipation efficiency
Solution Approach 2:
The patent introduces a vertical stacking architecture where multiple semiconductor layers are stacked with coolant channels flowing between them, utilizing the third dimension to increase heat dissipation surface area while maintaining a compact footprint
2Productivity
If more computing devices are packaged in a smaller area, then device integration density increases, but heat removal requirements increase
Solution Approach 1:
The patent transitions from planar to three-dimensional stacking architecture, allowing multiple computing devices to be integrated vertically in a smaller area while coolant channels flow through the stacked structure to remove heat from each layer efficiently
Solution Approach 2:
The patent divides the cooling system into multiple independent coolant channels that flow between individual stacked layers, allowing each layer to be cooled independently and efficiently, thereby managing heat removal requirements for high-density integration
3Loss of energy
If increased surface area is used for heat dissipation, then heat transfer efficiency improves, but device volume increases
Solution Approach 1:
The patent utilizes vertical stacking to increase heat dissipation surface area through the third dimension rather than expanding horizontally, allowing efficient heat transfer while maintaining a compact device volume
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves heat transfer efficiency, allowing for effective cooling of high-power electronic devices even in compact designs by leveraging the increased surface area and flow of liquid coolant through the microcooler trenches.
Implementation Method 1
causing a flow of liquid coolant through a plurality of fin trenches of a stacked semiconductor microcooler
Implementation Method 2
The first bonding layer is bonded to the second bonding layer... flow of liquid coolant through a plurality of fin trenches
Data Source
AI summary
A stacked semiconductor microcooler includes a first and second semiconductor microcooler. Each microcooler includes silicon fins extending from a silicon substrate. A metal layer may be formed upon the fins. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.