Stacked Micro-LED Epitaxial Structure for High-Resolution Full Color
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Solution Overview
Problem
Micro-LED displays face challenges in mounting and manufacturing due to the small size of micro-LEDs, requiring a high-resolution and full-color display with high color purity, and existing methods are complex and inefficient for producing such displays.
Innovation Solution
A light emitting stacked structure with epitaxial sub-units of different colors, where each sub-unit has a unique light emitting area and energy band, allowing for increased light emission area without increasing pixel area, and can be manufactured using wafer bonding to simplify the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If micro-LEDs are arranged on a two-dimensional plane to achieve high-resolution display, then the number of micro-LEDs required increases to hundreds of thousands or millions, but the mounting difficulty increases significantly due to their very small size of about 10,000 square μm or less
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of micro-LEDs to a three-dimensional stacked structure where multiple micro-LEDs are vertically stacked. This dimensional change allows multiple light-emitting elements to occupy a smaller footprint area, achieving high resolution without requiring mounting of hundreds of thousands of individual micro-LEDs on a flat surface. The stacked configuration reduces the number of discrete mounting operations needed.
Solution Approach 2:
The patent merges multiple micro-LEDs into a single stacked structure that functions as one integrated light-emitting unit. By combining multiple micro-LEDs vertically, the system reduces the number of separate mounting operations required, as the stacked structure can be handled and mounted as a single unit rather than individually mounting hundreds of thousands of tiny components.
2Measurement precision
If the area of each micro-LED is reduced to increase the number of pixels, then the light emitting area per pixel decreases, but the overall pixel area can be maintained through stacking
Solution Approach 1:
The patent compensates for the reduced light-emitting area of individual micro-LEDs by stacking them vertically. The total light-emitting area is distributed across multiple layers in the vertical dimension, allowing each micro-LED to be smaller while maintaining sufficient overall light output for the pixel. The stacked structure enables small individual emitters to achieve the required total illumination through cumulative effect across multiple layers.
3Manufacturing precision
If traditional individual mounting methods are used for micro-LEDs, then each micro-LED can be precisely positioned, but the manufacturing process becomes complex and inefficient
Solution Approach 1:
The patent combines multiple micro-LEDs into pre-assembled stacked structures that can be manufactured and tested before final mounting. This merging approach allows for batch processing and quality control at the stack level rather than requiring individual positioning of each micro-LED, significantly simplifying the manufacturing process while maintaining positioning accuracy through the integrated stack design.
Solution Approach 2:
The patent performs preliminary assembly and bonding of multiple micro-LEDs into stacked structures before final mounting. By pre-assembling the stacks with proper alignment and bonding in advance, the system eliminates the need for complex real-time positioning during final mounting, reducing manufacturing process complexity while ensuring precise positioning through the pre-established stack geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances light extraction efficiency and simplifies manufacturing, enabling the production of high-resolution, full-color displays with improved color purity and reduced size, overcoming the challenges of small micro-LEDs.
Implementation Method 1
each of the epitaxial sub-units configured to emit different colored light
Implementation Method 2
a plurality of pixels may be formed at the wafer level by wafer bonding
Data Source
AI summary
A display device including a substrate, a light emitting stacked structure disposed on the substrate and including a plurality of epitaxial sub-units disposed one over another, a first adhesive layer bonding the epitaxial sub-units to the substrate; and a line part disposed on the substrate and configured to apply a light emitting signal to each of the epitaxial sub-units, in which the light emitting stacked structure is configured to provide light having various colors by a combination of light emitted from each of the epitaxial sub-units, the first adhesive layer includes a conductive and non-transparent material, and the substrate includes a non-transparent material.