Stacked Micro-LED Layers for High Resolution Display Yield
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Solution Overview
Problem
Micro-LED full-color display technology faces challenges in high-resolution panels due to the difficulty and high cost of transferring and maintaining numerous small Micro-LED chips, resulting in low yield and limited popularization.
Innovation Solution
The implementation of a full-color display module with multiple light-emitting layers on substrates, where each pixel point is surrounded by a curved surface and includes red, green, and blue light-emitting portions, allowing for reduced chip density and simplified circuit wiring, with the option of using light-curing or heat-curing glue for lamination and independent testing of light-emitting layers to improve yield and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If numerous Micro-LED chips are used to achieve high-resolution full-color display, then display resolution and color quality are improved, but transfer difficulty and cost increase significantly
Solution Approach 1:
The patent divides the full-color display into multiple independent light-emitting layers, where each layer contains only single-color light-emitting chips (red, green, or blue). This segmentation reduces the number of different chip types that need to be transferred and assembled together, thereby reducing transfer difficulty and cost while maintaining high display resolution through the stacked layered structure.
2Measurement precision
If numerous Micro-LED chips are used to achieve high-resolution full-color display, then display resolution is improved, but maintenance difficulty increases
Solution Approach 1:
By segmenting the display into independent light-emitting layers with single-color chips, the patent enables easier maintenance. If a display defect occurs, the specific defective layer can be identified and replaced independently without needing to handle or replace numerous individual multi-color chips, thus reducing maintenance difficulty while preserving high display resolution.
3Measurement precision
If numerous Micro-LED chips are used to achieve high-resolution full-color display, then display quality is improved, but production yield decreases
Solution Approach 1:
The patent segments the complex multi-color chip assembly into multiple simpler single-color light-emitting layers. Each layer can be manufactured, tested, and assembled independently with fewer chip types, reducing assembly complexity and potential defects. This improves production yield while maintaining high display quality through the stacked layered architecture.
4Ease of manufacture
If multiple light-emitting layers are used to reduce chip density, then transfer difficulty is reduced, but structural complexity increases
Solution Approach 1:
The patent resolves the structural complexity issue by transitioning from a planar two-dimensional arrangement of mixed-color chips to a three-dimensional stacked layered structure. Each layer contains only single-color chips arranged in a simpler pattern, reducing in-plane complexity. The vertical stacking dimension organizes these layers systematically, making the overall structure more manageable despite the increased number of layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces transfer difficulties, increases yield, and simplifies maintenance, enabling more efficient production and application of high-resolution Micro-LED displays with improved color accuracy and reduced costs.
Implementation Method 1
The at least two light-emitting layers are successively laminated in the laminating direction by a light-curing glue or a heat-curing glue
Implementation Method 2
The at least two light-emitting layers are successively laminated in the laminating direction by a light-curing glue or a heat-curing glue
Implementation Method 3
a substrate in the lowermost light-emitting layer in the at least two light-emitting layers has a transparent or non-transparent structure at a position corresponding to the plurality of pixel points, and a substrate in a remaining light-emitting layer in the at least two light-emitting layers has a transparent structure at a position corresponding to the plurality of pixel points
Data Source
AI summary
Some embodiments provide a full-color display module and display device. The full-color display module includes at least two light-emitting layers. Any one of the at least two light-emitting layers includes a substrate and a plurality of light-emitting portions encapsulated on the substrate. A type of any one of the plurality of light-emitting portions is one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion. The at least two light-emitting layers are successively laminated in a laminating direction and form a plurality of pixel points. Any one of the plurality of pixel points is a surrounding area on the full-color display module, which is surrounded by a surrounding curved surface. The surrounding area of the any one of the plurality of pixel points includes at least one red light-emitting portion, at least one green light-emitting portion, and at least one blue light-emitting portion.