Stacked Micro-LED Structure for Lower-Current Display Emission
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Solution Overview
Problem
Micro-LED chips in display devices require high driving currents, leading to high heating and power consumption, which needs to be reduced while maintaining brightness.
Innovation Solution
A solid-state light-emitting device with multiple light-emitting components stacked vertically and connected in series, forming a stacked light-emitting structure, where each component includes a first and second electrode, semiconductor layers, and a source layer, with electrodes bonded to reduce driving current and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single PN structure micro-LED chip is used, then the device structure is simple, but the driving current is high resulting in high power consumption and heating
Solution Approach 1:
The single PN structure is divided into multiple independent PN junctions (first PN junction and second PN junction) that are connected in series. Each junction can be independently controlled, allowing the total forward voltage to be distributed across multiple junctions. This segmentation enables lower driving current for the same luminous output, thereby reducing power consumption and heat generation while maintaining a relatively simple overall device structure.
2Use of energy by moving object
If multiple light-emitting components are stacked in series, then the driving current is reduced and power consumption decreases, but the device structure becomes more complex
Solution Approach 1:
Multiple light-emitting components (first light-emitting component and second light-emitting component) are merged into a single integrated device structure with shared electrodes and integrated control. The components are electrically connected in series through shared electrode structures, allowing the device to achieve reduced driving current and power consumption while presenting a unified, manageable device architecture rather than separate complex components.
3Illumination intensity
If high driving current is used to maintain brightness, then the luminous brightness is sufficient, but the heating and power consumption increase significantly
Solution Approach 1:
The luminous output requirement is segmented across multiple PN junctions connected in series. Each junction operates at a lower current level compared to a single junction, but the combined luminous output of all junctions meets the required brightness. This segmentation approach maintains sufficient illumination intensity while significantly reducing the heating effect in each individual junction and the overall device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces driving current while maintaining luminous brightness, thereby decreasing power consumption and achieving the goal of reducing energy usage without increasing occupied space or reducing pixel resolution in display devices.
Implementation Method 1
the first electrode of one of every adjacent two light-emitting components of the multiple light-emitting components is bonded to the second electrode of the other of the adjacent two light-emitting components in the vertical direction to form an electrical connection
Implementation Method 2
multiple light-emitting components, and the multiple light-emitting components are sequentially stacked in a vertical direction and connected in series to form a stacked light-emitting structure
Data Source
AI summary
A solid-state light-emitting device and a production method thereof, and a display device are provided. The solid-state light-emitting device includes multiple light-emitting components sequentially stacked in a vertical direction and connected in series to form a stacked light-emitting structure. Each light-emitting component includes a first electrode, a second electrode, a first semiconductor layer, a source layer and a second semiconductor layer, and the first semiconductor layer, the source layer and the second semiconductor layer are sequentially stacked between the first electrode and the second electrode in the vertical direction. In addition, the first electrode of one of every adjacent two light-emitting components is bonded to the second electrode of the other of the adjacent two light-emitting components in the vertical direction to form an electrical connection.