Stacked Microprocessor Package Architecture With Thermal And Power Buses
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Solution Overview
Problem
The increasing complexity of microprocessor systems with multiple CPU cores poses challenges in providing adequate clean power and efficient heat removal due to the need for close physical proximity of microprocessor and memory dies, which complicates system density and performance.
Innovation Solution
The solution involves stacking microprocessor packages with substrates that include power buses for current delivery and thermal buses for heat removal, allowing for rotated configuration and independent thermal and power interfaces with the system, enabling efficient power distribution and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If microprocessor die are placed in close physical proximity to increase system density, then system density and throughput are improved, but providing adequate clean power and removing waste heat becomes more difficult
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of microprocessor die to a three-dimensional stacked configuration. Multiple substrates are stacked vertically with microprocessor die mounted on each substrate, allowing packages to be placed in close physical proximity while maintaining separate power and thermal management paths through the vertical dimension. The rotated configuration of stacked packages further optimizes spatial arrangement.
Solution Approach 2:
The system is divided into multiple independent substrate packages, each with its own power bus and thermal bus. This segmentation allows each package to be managed independently for power delivery and heat removal, reducing the complexity of providing clean power and removing waste heat from densely packed die while maintaining high system density.
2Device complexity
If multiple microprocessor die are integrated on a single substrate, then device complexity is reduced, but thermal management and power distribution become more challenging
Solution Approach 1:
Instead of integrating multiple microprocessor die on a single substrate, the patent segments them across multiple substrates stacked vertically. Each substrate has its own thermal bus that provides a direct thermal path from the die to the cooling apparatus, improving heat removal efficiency while maintaining manageable device complexity through modular integration.
Solution Approach 2:
The thermal bus acts as an intermediary between the microprocessor die and the cooling apparatus. Each substrate includes a thermal bus that interfaces to the backside of the die and provides a dedicated thermal path, enabling efficient heat removal from each package independently of others in the stack.
3Reliability
If separate power buses are provided for each microprocessor die, then power delivery quality is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent uses the vertical stacking dimension to provide separate power buses for each microprocessor die. Power buses are routed through the substrate thickness to deliver current to die on different substrates, maintaining high power delivery quality while simplifying manufacturing compared to complex lateral routing in planar configurations.
Solution Approach 2:
The substrate structure is designed with universal features including standardized power bus routing, thermal bus attachment points, and mechanical interfaces that can accommodate multiple die configurations. This multi-functionality allows the same substrate design to serve multiple purposes across different packages, reducing manufacturing complexity while maintaining reliable power delivery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for increased system density and improved performance by ensuring each microprocessor package has separate power and thermal management, reducing the impact of heat and power requirements on other packages and facilitating modular design.
Implementation Method 1
A thermal bus is attached to the backside of the primary die... The thermal buses of all the packages are tied into the system cooling
Implementation Method 2
A power bus for providing current to the primary die is attached to the substrate... The power buses of all the packages are tied into the system power buses
Implementation Method 3
A primary die is attached to a package substrate using standard flip-chip bonding techniques such as C4 bumps
Data Source
AI summary
A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.