Stacked Semiconductor Module Layout for Alignment Inspection
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Solution Overview
Problem
Existing semiconductor modules face challenges in detecting positional deviations between stacked semiconductor elements, as the lower element's position is often obscured by the upper element, making it difficult to observe and correct any misalignment.
Innovation Solution
The semiconductor module design includes two stacked semiconductor elements with a conductive member electrically connected to at least one element, and a resin mold that seals the elements and conductive member. The lower semiconductor element is arranged to expose both ends of its orthogonal sides when viewed from above without the resin mold, allowing for easy observation and detection of positional deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If two semiconductor elements are stacked vertically with the upper element covering the lower element, then the module structure is compact and integrated, but the lower element's position becomes unobservable and positional deviation cannot be detected
Solution Approach 1:
The patent divides the semiconductor elements into different positional zones (upper and lower elements) and implements different observation strategies for each zone. The lower element's corner portions are specifically designed to remain observable despite the stacked configuration, segmenting the observation requirements by spatial location.
Solution Approach 2:
The patent applies local quality by ensuring that specific corner portions of the lower semiconductor element maintain observability while other areas may be covered. This localized observability at critical corner positions allows deviation detection without requiring complete visibility of the entire lower element surface.
2Difficulty of detecting and measuring
If the semiconductor elements are arranged to be fully observable from above, then positional deviation can be easily detected, but the stacking efficiency and space utilization are reduced
Solution Approach 1:
The patent implements partial observability by ensuring only the corner portions of the lower element are visible from above, rather than requiring complete visibility of the entire element. This partial observation is sufficient for detecting positional deviations while maintaining efficient vertical stacking.
Solution Approach 2:
The patent transitions from requiring two-dimensional complete surface observability to achieving detection capability through one-dimensional corner portion visibility. This dimensional reduction in observation requirements enables both compact stacking and deviation detection to coexist.
Data Source
AI summary
A semiconductor module includes: two semiconductor elements stacked in a vertical direction to overlap at least a part of the semiconductor elements; a conductive member stacked on the semiconductor elements and electrically connected to at least one of the semiconductor elements; and a resin mold integrally sealing the semiconductor elements and the conductive member. A lower semiconductor element has at least observable positions of both ends of two sides substantially orthogonal to each other when viewed from above in the vertical direction without arranging the resin mold.