Stacked Electronic Module Antenna Integration
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Solution Overview
Problem
Conventional wireless communication modules face challenges in miniaturization due to the inability to integrally fabricate the antenna body with electronic elements, leading to increased size and susceptibility to electromagnetic interference (EMI) from high-frequency RF chips.
Innovation Solution
The electronic module design includes a first package with an encapsulant and an electronic element, and a second package with an insulating layer and antenna structure that extends through the layer, allowing for electrical connection and EMI shielding without increasing the module's size, utilizing conductive through holes and a metal layer for connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna body is exposed from the encapsulant, then the antenna can be formed, but the module size increases
Solution Approach 1:
The patent transitions from a planar antenna configuration to a three-dimensional stacked package structure. The antenna body is formed in a separate package layer above the encapsulant, utilizing the vertical dimension to resolve the conflict between miniaturization and antenna functionality. This allows the antenna to be manufactured without increasing the footprint of the main module.
Solution Approach 2:
The module is divided into distinct functional packages: a first package containing the electronic element and encapsulant, and a second package containing the antenna structure. This segmentation allows each component to be optimized and manufactured independently, then integrated through bonding, solving both the size constraint and manufacturing complexity issues.
2Device complexity
If high-frequency RF chips are positioned adjacent to digital chips, then integration is achieved, but electromagnetic interference occurs
Solution Approach 1:
The patent physically separates the high-frequency RF chip (in the first package) from digital chips by placing the antenna structure in a separate second package. This spatial segmentation reduces electromagnetic interference while maintaining integration through controlled electrical connections via bonding pads and conductive structures.
Solution Approach 2:
The insulating layer with conductive structures acts as an intermediary between the electronic element and the antenna structure. This intermediate layer provides electrical connection while offering electromagnetic shielding and isolation, reducing interference between adjacent components.
Data Source
AI summary
An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the insulating layer. The insulating layer is bonded to the encapsulant with the antenna structure being electrically connected to the electronic element. Since the second package having the antenna structure is stacked on the first package, the invention eliminates the need to increase the area of the first package for mounting the antenna structure and hence allows the electronic module to meet the miniaturization requirement.