Stacked Control Module Bracket for Contamination Isolation

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Solution Overview

Problem

Contamination from screws or assembly processes can lead to short circuit failures between terminals with narrow intervals in stacked electronic control modules, particularly in hybrid vehicle power control units.

Innovation Solution

An electronic control module design featuring a tubular bracket that creates a closed space between stacked boards, preventing contamination from adhering to electronic components, and using insulating coatings on certain components to prevent short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If boards are stacked with electronic components mounted close together to reduce size, then integration density is improved, but contamination from assembly processes can cause short circuit failures

Engineering Contradiction:

Improveintegration densityVSAvoidshort circuit risk

Core Design Contradiction:

Area of moving objectVSReliability

Solution Approach 1:

The patent divides the assembly space into separate regions by introducing a bracket structure that creates distinct zones between boards and around electronic components. This segmentation isolates contamination sources from sensitive areas while maintaining compact integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The bracket acts as an intermediary structure between boards and electronic components, providing physical separation and protection. It serves as a barrier that prevents contamination from reaching terminals while maintaining the compact stacked configuration.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If insulating coatings are applied to all electronic components to prevent short circuits, then reliability is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveshort circuit preventionVSAvoidcoating process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Instead of applying insulating coatings uniformly to all components, the patent applies coatings only to specific terminals or areas that are at risk of contamination. This localized approach maintains reliability where needed while reducing manufacturing complexity and cost.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The bracket structure is installed before final assembly to establish contamination barriers in advance. This preliminary protective measure reduces the need for extensive post-assembly coating operations, simplifying the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If a closed space is created between boards to prevent contamination, then reliability is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improvecontamination protectionVSAvoidheat dissipation

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The bracket creates a semi-enclosed space that provides contamination protection while maintaining thermal pathways. The structure allows heat to dissipate through designated areas while preventing contamination in sensitive zones, balancing protection and thermal management.

Inventive Principle:

Principle #30Flexible shells and thin films

Data Source

PatentUS12513822B2Electronic control module

Publication Date: 2025.12.30 NISSAN MOTOR CO LTD

AI summary

An electronic control module includes: a first board having an upper surface on which electronic components are mounted; a second board disposed on an upper surface side of the first board with an interval therebetween and having an upper surface on which electronic components are mounted; and a tubular bracket provided between the first board and the second board and defining a closed space between the first board and the second board.