Stacked Control Module Bracket for PCB Contamination Isolation
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Solution Overview
Problem
Contamination from screws can lead to short circuit failures between terminals on stacked boards in electronic control modules, particularly when electronic components have narrow intervals.
Innovation Solution
An electronic control module design featuring a tubular bracket that creates a closed space between stacked boards, preventing contamination from adhering to components, and using insulating coatings on certain components to prevent short circuits, with a thermally conductive plate to manage heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If boards are stacked to reduce space, then space utilization is improved, but contamination risk increases leading to short circuit failures
Solution Approach 1:
The internal space between stacked boards is segmented into a closed contamination-preventive space using the tubular bracket, separating the contamination-prone screwing area from the contamination-sensitive electronic component area
Solution Approach 2:
The tubular bracket acts as an intermediary structure that defines a closed space, preventing direct contact between contamination sources (screws) and vulnerable targets (electronic components with narrow terminal intervals)
2Reliability
If insulating coatings are applied to prevent short circuits, then reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The tubular bracket is installed beforehand to define the closed space, preventing contamination before assembly is complete, thereby eliminating the need for subsequent insulating coating operations
Solution Approach 2:
The solution extracts the contamination prevention function from the electronic components themselves (by providing a protective closed space) rather than requiring the components to be coated, simplifying the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents contamination and reduces costs by eliminating the need for coatings on certain components, while effectively managing heat through thermal conductivity, thereby reducing the risk of failures.
Implementation Method 1
a tubular bracket provided between the first board and the second board and defining a closed space between the first board and the second board
Implementation Method 2
with a thermally conductive plate to manage heat
Data Source
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AI summary
An electronic control module includes: a first board having an upper surface on which electronic components are mounted; a second board disposed on an upper surface side of the first board with an interval therebetween and having an upper surface on which electronic components are mounted; and a tubular bracket provided between the first board and the second board and defining a closed space between the first board and the second board.