Stacked Electronic Module Layout Without PCB Conduction Paths
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Solution Overview
Problem
Existing stacked electronic modules are hindered by the need for printed circuit boards (PCBs), which increase module height and prolong conduction paths between electronic devices.
Innovation Solution
A stacked electronic module design that eliminates the need for a PCB by using a magnetic device with exposed electrodes encapsulated in insulating layers and conductive patterns, allowing for direct electrical connections and reducing module height and conduction paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a PCB is used to connect electronic devices, then electrical connections are established, but the module height increases and conduction paths are prolonged
Solution Approach 1:
The patent merges the magnetic device with the circuit board function by integrating conductive patterns directly onto the magnetic device body. The magnetic device serves dual purposes: providing magnetic shielding/inductance and serving as the circuit board substrate, thereby eliminating the need for a separate PCB layer and reducing overall module height.
Solution Approach 2:
The patent transitions from a traditional planar PCB layout to a three-dimensional stacked configuration where conductive patterns are formed on multiple surfaces (top, bottom, and lateral) of the magnetic device. This dimensional transformation allows electrical connections to be established through vertical stacking rather than horizontal routing, reducing conduction path length and module height.
2Ease of operation
If a PCB is used to connect electronic devices, then electrical connections are established, but the conduction paths between devices are prolonged
Solution Approach 1:
The conductive patterns are integrated directly onto the magnetic device body, merging the circuit routing function with the magnetic component structure. This eliminates the need for separate PCB trace routing and reduces the distance electrical signals must travel between connection points.
Solution Approach 2:
The patent utilizes three-dimensional conductive pattern routing on multiple surfaces of the magnetic device, allowing electrical connections to be established through direct vertical and lateral pathways rather than extended planar traces. This dimensional approach significantly shortens conduction paths compared to traditional PCB routing.
3Ease of operation
If electrodes are exposed from the molding body, then electrical connections are accessible, but the structure becomes more complex
Solution Approach 1:
The patent combines the electrode structure with the magnetic device body itself, where the magnetic material serves as both the functional magnetic component and the structural support for electrodes. This integration simplifies the overall structure by eliminating separate electrode holders or mounting fixtures.
Solution Approach 2:
The magnetic device body performs multiple functions simultaneously: providing magnetic shielding, establishing electrical connections through integrated conductive patterns, and serving as the structural substrate for mounting electronic devices. This multi-functionality reduces the number of separate components needed and simplifies the overall structure.
Data Source
AI summary
A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.