Stacked Module Substrate With Auxiliary Conductor Pattern
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Solution Overview
Problem
Conventional substrates for stacked modules face issues with resin flow during thermal pressing, leading to potential connection failures and bonding instability between components, especially due to the lower rigidity of resin-based insulators compared to ceramics, which complicates reliable bonding and increases the risk of deformation and short circuits.
Innovation Solution
A substrate configuration that includes a stacked insulator with thermoplastic resin layers, a conductor pattern, an embedded component, a pad for ultrasonic bonding, and an auxiliary conductor pattern extending between the pad and the embedded component, which reduces resin flow and enhances the rigidity and stability of the bonding area, preventing deformation and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a thermoplastic resin stacked insulator is used, then ease of manufacture and cost are improved, but rigidity and bonding reliability deteriorate
Solution Approach 1:
The patent employs a composite structure combining thermoplastic resin layers with ceramic layers to achieve both ease of manufacture and high rigidity. The ceramic layers provide the necessary mechanical strength and stiffness, while the thermoplastic resin enables cost-effective manufacturing and good bonding characteristics. This composite approach resolves the contradiction by integrating materials with complementary properties.
Solution Approach 2:
The patent applies different material properties to different regions of the insulator structure. Ceramic layers are strategically positioned in areas requiring high rigidity and dimensional stability, while thermoplastic resin is used in regions where ease of manufacture and bonding flexibility are prioritized. This local differentiation allows the structure to simultaneously achieve both manufacturing ease and mechanical strength.
2Productivity
If thermal pressing is applied to bond insulator layers, then manufacturing efficiency is improved, but resin flow causes connection failures and bonding instability
Solution Approach 1:
The patent carefully controls thermal pressing parameters including temperature, pressure, and time to minimize resin flow while ensuring adequate bonding. By optimizing these parameters, the process achieves both high manufacturing efficiency and reliable bonding stability, preventing connection failures caused by excessive resin movement during the thermal pressing operation.
Solution Approach 2:
The patent incorporates preliminary design features such as rigid support structures and constrained geometries that prevent resin flow before thermal pressing occurs. These preventive measures are built into the structure design, ensuring that even under thermal pressing conditions, resin flow is minimized and bonding stability is maintained throughout the manufacturing process.
3Ease of manufacture
If the stacked insulator surface deforms due to resin flow, then manufacturing simplicity is maintained, but component bonding reliability deteriorates
Solution Approach 1:
The patent optimizes thermal pressing parameters to control resin flow and maintain surface flatness. By adjusting temperature, pressure, and time parameters within precise ranges, the process achieves both manufacturing simplicity and the required surface precision for reliable component bonding, preventing deformation while maintaining process efficiency.
Solution Approach 2:
The patent incorporates preliminary rigid support structures and constrained geometries that prevent surface deformation before bonding occurs. These preventive design features ensure that the insulator surface maintains its flatness and dimensional accuracy throughout the thermal pressing process, enabling reliable component mounting without compromising manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed configuration significantly reduces resin flow and increases the stability of both embedded and mounted components' bonding, ensuring high reliability and reduced electrical characteristic variations, while maintaining the structural integrity of the substrate.
Implementation Method 1
enhance stability of a portion to which an embedded component is bonded by thermocompression bonding of an insulator layer mainly composed of a thermoplastic resin
Implementation Method 2
a pad provided on a surface of the stacked insulator and configured to be ultrasonically bonded to a bump of a mounted component
Data Source
AI summary
A substrate for a stacked module includes a stacked insulator in which a plurality of insulator layers mainly composed of a thermoplastic resin are stacked, a conductor pattern arranged along the plurality of insulator layers in the stacked insulator, an embedded component connected to the conductor pattern, a pad provided on a surface of the stacked insulator and configured to be ultrasonically bonded to a bump of a mounted component to be mounted on the surface of the stacked insulator, and an auxiliary conductor pattern between the pad and the embedded component and extending in a range that covers the pad and the embedded component as viewed in a stacking direction of the plurality of insulator layers.