Stacked Semiconductor Modules With Recessed Bond Pad Access
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Solution Overview
Problem
The existing methods for stacking semiconductor device modules, such as shingled stacking, face limitations in increasing the number of modules due to increased size and footprint, requiring extensive iterative processes and varying module-to-module spacing, which are costly and inefficient.
Innovation Solution
The semiconductor device assemblies incorporate a substrate with individual modules featuring a stepped or filleted outer profile, allowing for vertical alignment of bond pads within recesses, reducing the overall height and footprint, and enabling more efficient wirebonding without the need for extensive spacer tapes or complex shingled arrangements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If shingled stacking is used to increase the number of modules, then module density is improved, but the footprint and overall size increase
Solution Approach 1:
The patent transitions from horizontal shingled stacking to vertical stacking arrangement, where modules are stacked one above another in the vertical dimension rather than offset horizontally. This dimensional change allows higher module density without increasing the horizontal footprint of the device assembly.
Solution Approach 2:
The patent implements a nested structure where multiple semiconductor modules are stacked vertically one inside another, with each module positioned above the previous one. The recesses in lower modules accommodate the bond pads of upper modules, creating a compact nested arrangement that maximizes vertical space utilization.
2Ease of operation
If spacer tape is used to space modules vertically, then access to bond pads is improved, but the overall height increases extensively
Solution Approach 1:
The patent uses filleted or rounded corners on the modules instead of sharp rectangular edges. This curvature allows the bond pads to be positioned at the rounded corners where they remain accessible for wirebonding while the module itself maintains a compact footprint, eliminating the need for extensive spacer tapes.
Solution Approach 2:
The patent creates local recesses or indented regions on the module surfaces at strategic positions where bond pads are located. These localized modifications provide access to bond pads without requiring the entire module to be spaced away from others, thus maintaining compact overall height while ensuring wirebonding accessibility.
3Reliability
If multiple groups of modules are arranged in shingled fashion, then electrical connection is facilitated, but the footprint occupied increases due to overhang regions
Solution Approach 1:
The patent arranges multiple groups of modules in vertical stacks rather than horizontal shingled patterns. Wirebonds extend vertically from bond pads on lower modules to bonding sites on upper modules within the same vertical stack, eliminating the need for horizontal overhang regions and reducing the overall footprint while maintaining reliable electrical connections.
Solution Approach 2:
The patent combines multiple functions into the vertical stacking arrangement: mechanical support, electrical connection, and space utilization are all achieved through the same vertical configuration. The recesses in lower modules serve both to support upper modules mechanically and to provide access paths for wirebonds electrically, merging structural and electrical functions.
Data Source
AI summary
A semiconductor device assembly can include a substrate including a plurality of external connections. The assembly can include a first individual module and a first bond pad. The first individual module can be disposed on the substrate such that the first side of the first individual module faces the substrate. In some embodiments, the first individual module electrically is coupled to an external connection of the substrate via the first bond pad. The assembly can include a second individual module comprising a plurality of lateral sides. The second individual module can be disposed over the first individual module. In some embodiments, a first lateral side of the second individual module includes a first step forming a first overhang portion and a first recess. In some embodiments, the first bond pad is vertically aligned with the first recess of the second individual module.