Stacked Electronic Modules With Shifted Connectors
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Solution Overview
Problem
Existing electronics systems with modules or systems on a chip (SoCs) installed on a base board leave little room for additional components due to identical connectors and wasted space, as each module occupies a reserved portion of the base board.
Innovation Solution
The system involves stacking modules on a base board by shifting pins to maintain electrical connections, allowing for vertical stacking and utilizing additional space on the base board, which can also accommodate smaller or more compact base boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If modules are installed on a base board with identical connectors, then electrical connections are simplified, but base board space is wasted and no room remains for additional components
Solution Approach 1:
The patent transitions from a two-dimensional base board layout to a three-dimensional stacked configuration. Modules are arranged vertically in layers, with lower modules connected to the base board and upper modules connected to lower modules through shifted connectors. This dimensional change allows multiple modules to occupy the same horizontal footprint while maintaining electrical connectivity, thereby utilizing base board space efficiently without compromising connection simplicity.
2Area of stationary object
If modules are stacked vertically to save space, then base board area utilization improves, but connector alignment and electrical connections become more complex
Solution Approach 1:
The patent employs asymmetric connector positioning where upper modules are shifted horizontally relative to lower modules. Specifically, connectors on upper modules are offset from their counterparts on lower modules, allowing vertical stacking while maintaining proper electrical alignment. This asymmetric arrangement enables space-efficient stacking without requiring complex alignment mechanisms, as the shift pattern is built into the connector design itself.
Solution Approach 2:
The patent introduces intermediate connectors as mediators between upper and lower modules. These connectors serve as the interface that bridges the horizontal offset between modules, enabling electrical connection despite the shifted positioning. The intermediate connector design absorbs the alignment complexity, allowing modules to be stacked vertically while maintaining simple connection procedures through standardized intermediate interfaces.
3Ease of manufacture
If identical connectors are used for all modules, then manufacturing is simplified, but base board portions under modules are left unused and wasted
Solution Approach 1:
The patent resolves the space waste issue by moving from horizontal to vertical arrangement. Identical connectors are used across all modules for manufacturing simplicity, but modules are stacked in vertical layers with horizontal offsets. This allows the base board area under each module to be utilized by stacking additional modules above it, converting previously wasted vertical space into functional areas for additional components or modules.
Data Source
AI summary
Various systems may benefit from suitable arrangements and configurations of modules. For example, certain electronics systems may benefit from systems and methods for stacking electronic modules on a base board. A system of stacking computer modules can include a base board, which can be a printed circuit board (PCB). The system can also include a first plurality of connectors, mounted to and in electrical communication with the base board. The system can further include a first module, the first module including a second PCB and a second plurality of bottom connectors configured to engage the first plurality of connectors and a third plurality of top connectors. The system can additionally include a second module, the second module including a third PCB and a fourth plurality of bottom connectors configured to engage the third plurality of top connectors of the first module.