Stacked Mounting Structure With Vertical Electroconductive Members
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Solution Overview
Problem
Existing stacked mounting structures face challenges in narrowing pitch, assembling multiple electronic circuit boards, and accommodating components with varying heights, leading to restricted design flexibility and increased substrate thickness.
Innovation Solution
A stacked mounting structure featuring electroconductive members with a cross-section similar to or smaller than the connection area, extending between facing members, and a reinforcing member to secure components, allowing for flexible wiring and reduced substrate area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional substrate connecting members with core body and elastic body are used, then connection reliability is improved, but device complexity increases and small sizing becomes difficult
Solution Approach 1:
The patent merges the core body and elastic body into a single integrated substrate connecting member. The connecting member has a unified structure where the elastic properties are inherent to the single piece construction, eliminating the need for separate core body and elastic body components while maintaining connection reliability.
Solution Approach 2:
The substrate connecting member serves multiple functions simultaneously: it provides mechanical connection, electrical connection through conductive material, and elastic compliance all within a single component. This multi-functionality reduces the number of parts needed while maintaining reliable connections.
2Quantity of substance
If multiple connecting members are assembled in recess, then connection density is improved, but assembling and position adjustment become difficult
Solution Approach 1:
The substrate connecting member is designed as a separate, modular component that can be independently positioned and adjusted before final assembly. This segmentation allows for easier position adjustment and assembly compared to integrated recess structures, while still achieving high connection density through multiple connecting members.
3Reliability
If through hole connections are used to connect circuit layers, then electrical connection is achieved, but pitch narrowing and area reduction become difficult
Solution Approach 1:
The patent transitions from planar through-hole connections to three-dimensional stacked connections using vertical substrate connecting members. This dimensional change allows electrical connections to be made in the vertical direction rather than requiring large horizontal pitch, enabling pitch narrowing and substrate area reduction while maintaining reliable electrical connections.
Data Source
AI summary
A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.