Stacked Mounting Structure with Protruding Electrodes
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Solution Overview
Problem
Conventional stacked mounting structures face challenges in automating the connection of substrates, leading to high manufacturing costs and reduced productivity due to manual labor, difficulty in miniaturization, and increased electrical resistance.
Innovation Solution
A stacked mounting structure featuring a first and second substrate with components mounted on them, an intermediate spacer with a gap, and protruding electrodes and electroconductive portions for electrical connection, allowing for improved automation and reduced resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If lead wires are used to connect substrates in conventional stacked mounting structures, then electrical conduction between substrates is secured, but automation of joining is difficult and manual labor is required leading to increased mounting cost and reduced productivity
Solution Approach 1:
The invention extracts and eliminates the lead wire component from the substrate connection system. Instead of using lead wires that require manual handling and soldering, the patent employs direct electroconductive connections between substrates through the spacer, thereby enabling automation and improving productivity
Solution Approach 2:
The spacer serves as an intermediary element that provides both mechanical support and electrical conduction pathways. By integrating electroconductive portions into the spacer structure, the invention mediates the connection between substrates without requiring separate lead wires, thus enabling automated assembly
2Length of moving object
If manual handling of lead wires is used for small structures, then electrical connection can be achieved, but the structure cannot be made smaller due to limitations in manual handling capability and controllable gap between lead wires
Solution Approach 1:
The invention removes the lead wire component entirely, eliminating the constraints associated with manual handling of thin lead wires and the minimum controllable gaps required for such operations. This allows substrates to be positioned closer together and enables further miniaturization of the overall structure
Solution Approach 2:
The spacer structure provides self-aligning electroconductive pathways that automatically establish electrical connections when substrates are mounted, eliminating the need for precise manual manipulation of lead wires and gaps, thus enabling smaller structure dimensions
3Reliability
If anisotropic electroconductive film is used to join electroconductive spacer and substrate, then connection is achieved, but connection resistance becomes high
Solution Approach 1:
The invention employs composite electroconductive structures combining metal electroconductive portions within the spacer and electroconductive films on substrate surfaces. This composite approach creates multiple parallel conduction pathways with lower overall resistance compared to single-material anisotropic films
Solution Approach 2:
The electroconductive portions of the spacer are merged directly with the electroconductive films on substrate surfaces to form integrated low-resistance connection paths. This merging eliminates the high resistance associated with relying solely on anisotropic electroconductive films
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances yield, reduces costs, and shortens manufacturing time while enabling smaller substrate sizes with lower electrical resistance and improved connection quality.
Implementation Method 1
an electroconductive portion which is formed on a surface of the intermediate member orthogonal to a surface on which the first electrode or the second electrode is formed, and which electrically connects the first electrode and the second electrode
Data Source
AI summary
In a stacked mounting structure At least a pair of a first connecting terminal and a second connecting terminal is formed, and further, the stacked mounting structure includes a protruding electrode which is provided on at least any one of the first connecting terminal and the second connecting terminal, and an electroconductive paste which is formed on a side surface of an intermediate substrate, and which electrically connects the first connecting terminal and the second connecting terminal. The first connecting terminal and the second connecting terminal are exposed by a recess in a surface of the intermediate substrate. The first connecting terminal and the second connecting terminal are electrically connected via the protruding electrode and the electroconductive paste in the recess which is provided in the intermediate substrate.