Stacked Mounting Structure With Independent Substrate Testing Electrodes
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Solution Overview
Problem
Conventional stacked mounting structures lack the ability to test individual layers after formation, making it difficult to identify defects and leading to reduced yield and reliability due to the collective testing of all layers, especially when some layers are defective, and the complexity of testing all functions simultaneously.
Innovation Solution
A stacked mounting structure with a first and second substrate, an intermediate member, and electroconductive members, where electrodes for testing are provided on the first substrate to connect and test the first and second electronic components, allowing for independent testing of each substrate after formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If testing is performed after formation of the stacked mounting structure, then the entire structure can be tested collectively, but individual layer testing becomes impossible and defect location identification becomes difficult
Solution Approach 1:
The patent divides the testing function into separate segments for each substrate layer. First substrate includes first electrode for testing the first electronic component, while second substrate includes second electrode for testing the second electronic component. This segmentation allows independent testing of each layer even after stacked mounting structure formation, enabling precise defect location identification.
2Ease of manufacture
If all layers are considered defective when any part is defective, then quality control is simplified, but yield degradation occurs
Solution Approach 1:
The patent implements segmented testing electrodes on each substrate that can independently test specific layers. The first electrode tests only the first electronic component on the first substrate, and the second electrode tests only the second electronic component on the second substrate. This enables selective identification of defective layers, allowing non-defective layers to be salvaged and reused, thereby improving yield while maintaining quality control.
Solution Approach 2:
The patent introduces an intermediate member with electroconductive member that serves as a mediator to electrically connect the second electrode on the second substrate to the second electronic component. This intermediary structure enables independent testing of the second layer without affecting the first layer, facilitating selective defect identification and reducing unnecessary rejection of good components.
3Reliability
If expensive components are used in each layer, then component performance is improved, but cost increases substantially when defects occur
Solution Approach 1:
The patent segments the testing capability to each substrate layer, allowing precise identification of which expensive component is defective. When a defect is detected, only the specific defective substrate needs to be replaced rather than the entire stacked structure, significantly reducing the cost impact of component failures in expensive multi-layer assemblies.
4Adaptability or versatility
If functions of the stacked mounting structure are complicated, then functionality is improved, but testing complexity increases and reliability of testing degrades
Solution Approach 1:
The patent divides the complex testing function into separate, simplified electrode tests for each substrate. Each electrode tests only its corresponding electronic component on its own substrate, breaking down the complex multi-layer testing into simple, independent single-layer tests. This segmentation maintains the ability to test complicated multi-functional stacked structures while avoiding testing complexity and reliability degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables individual testing of each substrate, improving defect identification and quality, allowing for a more compact design, reducing the need for external electrodes, and simplifying the testing process by allowing access from a single direction, thereby reducing the risk of damage and shortening testing time.
Implementation Method 1
an electroconductive member which is provided to the intermediate member
Implementation Method 2
a first electrode for testing which is an electrode for testing an operation of the first electronic component
Data Source
AI summary
A stacked mounting structure includes a first substrate which includes a first electronic component, a second substrate disposed facing the first substrate and including a second electronic component, an intermediate member having a space for accommodating the second electronic component, an electroconductive member provided to the intermediate member, a first electrode for testing electrically connected to the first electronic component, as an electrode for testing an operation of the first electronic component, a connecting electrode toward the second substrate electrically connected to the second electronic component, as an electrode for electrically connecting to the electroconductive member, and a second electrode for testing provided to the first substrate as an electrode for testing an operation of the second electronic component and electrically connected to the second electronic component via the electroconductive member and the connecting electrode toward the second substrate.