Stacked Multi-Color Semiconductor Structure for High-Resolution LEDs
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Solution Overview
Problem
Conventional LED display panels face challenges in increasing resolution due to crowded circuits and large area occupation as LEDs of multiple colors are arranged on the same plane, making manufacturing difficult.
Innovation Solution
A semiconductor structure with a light-emitting stack layer comprising multiple light-emitting layers emitting different colors, stacked in a direction, allowing for a more compact design that reduces the need for multiple electrodes and simplifies manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If LEDs of multiple colors are arranged on the same plane, then full-color display is achieved, but the area occupied is large and resolution cannot be improved
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of multiple colored LEDs to a three-dimensional stacked structure where light-emitting layers are arranged vertically. This dimensional change allows multiple colors to be emitted from a compact vertical stack rather than requiring horizontal space, thereby reducing the occupied area while maintaining full-color display capability.
2Adaptability or versatility
If LEDs of multiple colors are arranged on the same plane, then full-color display is achieved, but circuits become excessively crowded and manufacturing becomes difficult
Solution Approach 1:
By stacking light-emitting layers vertically in the third dimension, the patent eliminates the need for complex planar circuit routing that connects multiple separate LEDs. The vertical stack can be electrically connected through simplified conductive structures, reducing circuit crowding and making the manufacturing process more straightforward.
Solution Approach 2:
The patent merges multiple light-emitting layers into a single integrated stacked structure, consolidating what would otherwise require multiple separate LED components and their associated circuits. This merging reduces the overall complexity of the device and simplifies the manufacturing process.
3Adaptability or versatility
If LEDs of multiple colors are arranged on the same plane, then full-color display is achieved, but resolution cannot be improved due to crowded circuits
Solution Approach 1:
The vertical stacking of light-emitting layers enables higher resolution by compacting the display structure in the vertical dimension. This allows for smaller pixel sizes and tighter spacing between display elements, as the vertical stack eliminates the need for extensive lateral circuit routing that limits planar resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves resolution and miniaturization by reducing the area occupied by light-emitting layers and simplifying the manufacturing process, while maintaining full-color display capabilities.
Implementation Method 1
The plurality of light-emitting layers are configured to emit different colors of light
Data Source
AI summary
A semiconductor structure includes a substrate, a first type semiconductor layer, a light-emitting stack layer, and a second type semiconductor layer. The first type semiconductor layer is disposed on the substrate. The light-emitting stack layer includes a plurality of light-emitting layers stacked on the first type semiconductor layer. The plurality of light-emitting layers are configured to emit different colors of light, and wavelengths of the different colors of light fall within a range of 200 nm to 2000 nm. The second type semiconductor layer is disposed on the light-emitting stack layer.