Stacked Multi-Chip Package EMI Shielding via Faraday Cage
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Solution Overview
Problem
Current multi-chip packages face challenges in effectively isolating sensitive components from electromagnetic interference (EMI) due to the impracticality of physical separation and limited effectiveness of decoupling, with traditional shielding methods consuming space and being prone to dislodgment and moisture accumulation.
Innovation Solution
A stacked multi-chip package design featuring a grid array of metallic connecting nodes between substrates with laminated ground planes, forming a conductive Faraday cage around the electronic component to shield it from EMI, with the component encapsulated in a resin casing for robustness and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal can is used to enclose the component for EMI shielding, then EMI protection is improved, but the package space is increased and the structure becomes less robust
Solution Approach 1:
The patent transitions from a two-dimensional planar shield to a three-dimensional stacked configuration. By stacking substrates vertically and using through-holes to connect ground planes across multiple layers, the shield occupies vertical space rather than horizontal space, reducing the footprint area while maintaining shielding effectiveness.
Solution Approach 2:
The shielding structure is nested within the existing multi-chip package architecture. The conductive nodes are embedded in through-holes of the substrate, and ground planes are integrated into the substrate layers themselves, rather than adding external shielding components. This nesting approach eliminates the need for separate metal cans while providing equivalent EMI protection.
2Object-affected harmful factors
If a metal can is used to enclose the component for EMI shielding, then EMI protection is improved, but the structural reliability deteriorates due to dislodgment risk
Solution Approach 1:
The shielding function is merged with the substrate structure itself. The ground planes are laminated between dielectric layers of the substrate, and conductive nodes are integrated into the through-holes. This integration eliminates separate shielding components that could dislodge, making the shielding structure as robust as the substrate itself.
Solution Approach 2:
The shielding structure is built into the substrate during substrate fabrication, before the chips are mounted. The conductive nodes are formed in through-holes and connected to ground planes as part of the substrate manufacturing process, ensuring the shielding structure is permanently integrated and cannot dislodge during assembly or operation.
3Area of stationary object
If multiple chips are tightly packed in a small package, then device miniaturization is improved, but physical separation of sensitive components from EMI sources becomes impractical
Solution Approach 1:
The patent uses vertical stacking to separate sensitive components from EMI sources in the third dimension (height) rather than requiring horizontal separation. By placing sensitive chips on one substrate and EMI-generating chips on another substrate in the stack, and using grounded conductive nodes between layers, the design achieves physical separation while maintaining compact footprint.
Solution Approach 2:
The conductive nodes and ground planes between substrates act as intermediary shielding layers. These intermediaries block EMI paths between chips on different substrates, enabling tight packing while preventing interference. The grounded conductive structure mediates between EMI sources and sensitive components, allowing co-location without interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective EMI shielding, enhancing the robustness of the package and preventing moisture accumulation while maintaining a compact design, effectively isolating the component from both generating and receiving EMI.
Implementation Method 1
at least a group of the metallic connecting nodes surround the electronic component and are electrically connected to both the first ground plane and the second ground plane
Data Source
AI summary
A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each substrate has a conductive plane associated with it. An electronic component is mounted between the first and second substrates and is surrounded by a group of the metallic connecting nodes that are also electrically connected to the conductive planes of both substrates to form a conductive Faraday cage about the component.