Stacked Nanosheet Transistor Layout for Lower Parasitic Capacitance

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Three-dimensional transistor structures experience electrical vulnerabilities such as parasitic capacitance between the contact metal and gate metal, which reduces device performance.

Innovation Solution

A nanosheet transistor device with a transistor stack comprising a lower tri-gate nanosheet transistor and an upper tri-gate nanosheet transistor, where the upper nanosheet transistor has a different width and gate width than the lower one, and a gate-free region adjacent the source/drain contact to reduce parasitic capacitance by removing a portion of the gate electrode material closest to the source/drain contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If three-dimensional transistor structures are used to increase transistor density, then transistor density is improved, but parasitic capacitance between contact metal and gate metal increases

Engineering Contradiction:
Improvetransistor densityVSAvoidparasitic capacitance
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The gate electrode is segmented into multiple sections along the channel length, with different sections having different widths. This segmentation allows the gate to maintain adequate width for control while reducing the width near contacts, thereby reducing parasitic capacitance while preserving transistor density benefits

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different sections of the gate electrode are given different local properties - wider sections over the channel for strong control and narrower sections near contacts for reduced parasitic capacitance. This local differentiation resolves the contradiction between needing wide gates for control and narrow gates near contacts for low parasitic capacitance

Inventive Principle:
Principle #3Local quality

2Object-generated harmful factors

If gate electrode material is removed to reduce parasitic capacitance, then parasitic capacitance is reduced, but gate control capability may be weakened

Engineering Contradiction:
Improveparasitic capacitanceVSAvoidgate control capability
Core Design Contradiction:
Object-generated harmful factorsVSReliability

Solution Approach 1:

The gate is divided into segments where only the portions near contacts are narrowed or removed, while the central channel portions maintain full width for adequate control. This selective segmentation reduces parasitic capacitance without compromising gate control capability

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The gate electrode exhibits local quality variations - full width for strong control in channel regions and reduced width near contacts for low parasitic capacitance. This local differentiation ensures control capability is maintained where needed while reducing parasitic effects where appropriate

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11843001B2Devices including stacked nanosheet transistors
Publication Date: 2023.12.12 SAMSUNG ELECTRONICS CO LTD
  • US11843001B2 patent drawing
  • US11843001B2 patent drawing
  • US11843001B2 patent drawing

AI summary

Nanosheet transistor devices are provided. A nanosheet transistor device includes a transistor stack that includes a lower nanosheet transistor having a first nanosheet width and a lower gate width. The transistor stack also includes an upper nanosheet transistor that is on the lower nanosheet transistor and that has a second nanosheet width and an upper gate width that are different from the first nanosheet width and the lower gate width, respectively. Related methods of forming a nanosheet transistor device are also provided.