Stacked Optical Module Transmitter Receiver Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In optical modules, the side-by-side arrangement of transmitter and receiver optical components limits the module's width usage, leading to restricted layout and heat dissipation issues, as well as increased crosstalk and signal integrity problems due to the close proximity of high-speed signal channels.
Innovation Solution
The optical components are stacked perpendicular to the printed circuit board, allowing for a more efficient use of module width, improved heat dissipation through a larger thermal path, and separation of signal paths to reduce crosstalk by arranging transmitter and receiver interfaces on opposite surfaces of the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the transmitter optical component and the receiver optical component are arranged side by side from left to right, then the layout follows the conventional modular structure, but the module width is limited and heat dissipation is poor
Solution Approach 1:
The patent changes the arrangement dimension from horizontal (left-to-right) to vertical (up-and-down), stacking the transmitter optical component and receiver optical component in the vertical direction. This dimensional change allows both components to be arranged within the same horizontal footprint while improving heat dissipation by placing the heat-generating transmitter component above the receiver component, enabling better thermal management through the module structure.
2Device complexity
If the transmitter optical component and the receiver optical component are arranged side by side, then the conventional layout is maintained, but the signal channel gap is limited causing crosstalk
Solution Approach 1:
The patent arranges the transmitter optical component and receiver optical component in the vertical direction rather than horizontally, creating sufficient vertical spacing between signal channels. This vertical separation increases the gap between high-speed signal pathways, reducing electromagnetic coupling and crosstalk, thereby improving signal integrity while maintaining layout simplicity.
3Reliability
If the transmitter optical component and receiver optical component are stacked vertically, then heat dissipation and signal separation are improved, but the component arrangement becomes more complex
Solution Approach 1:
The patent divides the optical module into distinct vertical segments: the transmitter optical component in the upper portion, the receiver optical component in the lower portion, and the printed circuit board in the middle. This segmentation clearly defines the functional zones and simplifies the overall arrangement by assigning each component to a specific vertical level, reducing design complexity despite the vertical stacking approach.
Solution Approach 2:
The patent applies local quality by optimizing the vertical positioning of each component according to its specific requirements: the transmitter optical component (heat-generating) is placed in the upper region for better heat dissipation, the receiver optical component is placed in the lower region, and the printed circuit board is positioned in the middle to facilitate electrical connections. This localized optimization simplifies the overall design by addressing each component's specific needs in its designated zone.
4Ease of manufacture
If the transmitter optical component and receiver optical component are arranged side by side, then the electrical interface layout is simple, but the via hole requirements increase causing signal integrity issues
Solution Approach 1:
The patent changes the component arrangement from horizontal to vertical, which repositions the electrical interface requirements. By stacking the transmitter and receiver components vertically with the printed circuit board in the middle, the electrical connections can be established with fewer via holes traversing the board thickness, reducing signal integrity issues while maintaining interface layout simplicity.
Data Source
AI summary
An optical module includes an optical fiber connector, a transmitter optical component, a receiver optical component and a printed circuit board arranged within an optical module housing; the transmitter optical component and the receiver optical component are optically coupled to the optical fiber connector, and electrically connected to the printed circuit board which is arranged horizontally within the optical module housing. The transmitter optical component and the receiver optical component are stacked in a direction perpendicular to the printed circuit board. Stacking the transmitter optical component and the receiver optical component makes use of the width of the optical module by improving design flexibility of the optical path and the electric circuit, reducing or even substantially eliminating crosstalk between the high-speed devices and high-speed signals, and improving the heat dissipation effect of the optical module.