3D Stacked Optical Receiver Assembly Package
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Solution Overview
Problem
In optical networks, existing optical receiver subassemblies face challenges in compactness and cost-effectiveness due to complex electrical modulation schemes requiring high signal integrity and precise alignment of photodetectors and integrated circuits, while also needing to handle multiple wavelengths efficiently.
Innovation Solution
A three-dimensional (3D) stacked optical receiver assembly package design with separate functional layers for optical routing, wavelength demultiplexing, and electrical components, utilizing a receptacle subassembly, housing, and electrical subassembly with photodetectors and integrated circuits, allowing for reduced overall size and minimal footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional planar layout is used for optical receiver components, then ease of manufacture is improved, but the overall size and footprint of the assembly increases
Solution Approach 1:
The patent transitions from a traditional planar (2D) layout to a three-dimensional stacked architecture where optical and electrical subassemblies are arranged in vertical layers. This dimensional change allows components to be positioned in multiple levels rather than spread out horizontally, significantly reducing the overall footprint while maintaining all necessary functional relationships through precise vertical alignment.
Solution Approach 2:
The patent implements a nested configuration where the electrical subassembly is positioned within the housing that contains the optical subassembly. The electrical components are arranged in a compact stacked layout that fits within the overall package envelope, with circuit boards and photodetectors arranged in multiple layers that nest efficiently within the available volume.
2Reliability
If component count is reduced for compactness, then device complexity is reduced, but signal integrity may be compromised
Solution Approach 1:
The patent divides the wavelength demultiplexing function into separate modular components including diffraction grating elements and distinct photodetector arrays for different wavelength channels. This segmentation allows each component to be optimized independently while maintaining overall system performance, reducing the need for complex integrated solutions that would compromise signal integrity.
Solution Approach 2:
The patent introduces optical waveguides and routing structures as intermediary elements that efficiently transport optical signals between the diffraction grating and photodetector arrays. These intermediaries maintain signal integrity by providing dedicated optical pathways that minimize loss and interference, while allowing compact physical arrangement of the demultiplexing components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The 3D design minimizes the overall length and cost of the optical assembly package, enabling efficient handling of multiple wavelengths with reduced component count and improved signal integrity, suitable for advanced modulation schemes in compact transceiver formats like QSFP+ and QSFP28.
Implementation Method 1
a diffraction grating mounted on a bottom wall of the housing
Implementation Method 2
a first photodetector and a second photodetector for receiving the light beams
Data Source
AI summary
An optical assembly package is provided for the optical receive components of an optical transceiver. The optical assembly package includes a receptacle subassembly configured to receive an end of an optical fiber. A housing is provided having an opening at one end configured to receive the receptacle assembly. Optical routing and wavelength demultiplexing elements are mounted to a bottom wall of the housing. An electrical subassembly comprising a support plate, a circuit board mounted on the support plate, an integrated circuit mounted to the circuit board, and a plurality of photodetectors mounted to the support plate proximate an edge of the circuit board. The electrical subassembly is positioned a stacked arrangement beneath the housing to minimize an overall length of the optical assembly package.