Stacked Optical Semiconductor Device Resin Encapsulation
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Solution Overview
Problem
Conventional methods for downsizing solid-state imaging devices face challenges such as complex manufacturing processes, increased design costs, and reliability issues due to penetrating electrodes, which lead to larger package sizes and higher production costs.
Innovation Solution
The optical apparatus features a stacked configuration of an optical device and a semiconductor device encapsulated by a resin member, with penetrating electrodes formed within the resin, allowing for a compact design without sacrificing reliability and enabling flexible design changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional ceramic packages and resin mold packages are used, then packaging is provided, but downsizing cannot be achieved
Solution Approach 1:
The patent transitions from conventional lateral packaging arrangements to a vertical stacked configuration where the optical device and semiconductor device are arranged in the thickness direction. This dimensional change enables compact packaging by utilizing the vertical space, achieving downsizing while maintaining functional integrity
Solution Approach 2:
The patent embeds the semiconductor device within the resin member that encapsulates the optical device. The resin member serves as a container that holds both devices in a nested arrangement, with the semiconductor device positioned above the optical device and both surrounded by the same resin encapsulation, achieving compact integration
2Reliability
If penetrating electrodes are used to connect devices, then electrical connection is achieved, but package size increases and reliability decreases
Solution Approach 1:
The patent removes the penetrating electrode structure from the design. Instead of using electrodes that penetrate through the substrate and resin, the invention uses surface-mounted pad electrodes and wiring electrodes that remain on the surface, eliminating the need for deep penetrating structures and associated manufacturing complexity
Solution Approach 2:
The patent shifts electrical connection from a vertical penetrating approach to a surface-level approach. Connection electrodes and wiring electrodes are arranged on the surface of the resin member, utilizing the lateral dimension for electrical pathways instead of penetrating through the thickness, thereby reducing package size and improving reliability
3Ease of manufacture
If penetrating electrodes and insulating layers are added, then electrical connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent eliminates the need for penetrating electrodes, insulating layers covering penetrating electrodes, and associated seed layers and electrically conductive layers. The manufacturing process is simplified by removing these complex steps and using only surface-mounted electrodes and wiring that can be formed using conventional semiconductor fabrication techniques
Solution Approach 2:
Instead of creating holes through the substrate and filling them with electrodes (penetrating electrode approach), the patent inverts the approach by using surface-level electrodes and wiring that connect devices through the resin member without penetration, thereby simplifying the manufacturing process and reducing structural complexity
Data Source
AI summary
A downsized, highly reliable optical apparatus is stably and easily manufactured with high productivity. The optical apparatus includes: an optical device having a principal surface including an optical unit; a transparent member disposed facing the optical unit; a semiconductor device disposed above a back surface of the optical device and electrically connected to the optical device, the back surface being opposite the principal surface; and a resin member provided in a region adjacent to the optical device and the semiconductor device above a surface of the transparent member, the surface of the transparent member facing the optical device.