Stacked Optical Sensor Package With Embedded ISP Integration
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Solution Overview
Problem
Current packaging technologies for semiconductor optical sensors do not effectively integrate image signal processors with optical sensor dies, limiting imaging performance in advanced applications like automotive systems.
Innovation Solution
A stacked wafer-level chip scale package is developed, where an optical sensor die with an optically active area is covered by a transparent material, and an image signal processor die is embedded in a molding layer on the backside of the semiconductor wafer, allowing for improved imaging performance by integrating both dies within a single package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical sensor dies are packaged as single die in traditional IC packages, then packaging simplicity is maintained, but imaging performance is limited due to inability to integrate image signal processor
Solution Approach 1:
The patent merges the optical sensor die and image signal processor die into a single stacked package structure. The optical sensor die is placed on top of the image signal processor die, with their respective bonding pads electrically connected through vertical vias. This integration allows the image signal processor to directly process captured images, improving imaging performance while maintaining a compact form factor.
Solution Approach 2:
The patent implements a nested structure where one die is positioned on top of another die within the same package. The optical sensor die is nested above the image signal processor die, creating a vertical stacking arrangement that maximizes space utilization and enables direct electrical and optical interaction between the two functional components.
2Reliability
If multiple dies are integrated in the same IC package, then imaging performance is improved, but packaging complexity increases
Solution Approach 1:
The patent segments the imaging system into two separate but integrated dies: an optical sensor die for capturing light and an image signal processor die for processing the captured images. Each die can be manufactured and tested independently using standard semiconductor fabrication processes, then combined through wafer-level packaging techniques, making the manufacturing process manageable despite the integration complexity.
Solution Approach 2:
The patent transitions from a planar packaging arrangement to a three-dimensional stacked arrangement. By stacking the optical sensor die vertically above the image signal processor die, the design utilizes the vertical dimension to integrate multiple functions within a compact footprint, simplifying interconnect routing and reducing the overall package area required.
3Adaptability or versatility
If traditional single-die packaging is used, then manufacturing simplicity is maintained, but advanced applications like ADAS cannot achieve required performance
Solution Approach 1:
The stacked die package structure provides a universal platform that can serve multiple advanced applications requiring high-performance imaging, such as augmented reality, autonomous vehicles, and advanced driver assistance systems. The modular architecture allows different configurations of optical sensor and processor dies to be adapted for various application requirements while maintaining the same fundamental integration approach.
Data Source
AI summary
In a general aspect, a package includes an optical sensor die fabricated in a semiconductor wafer. The optical sensor die has an optically active area on a front side of the semiconductor wafer generating a raw image signal. A transparent cover attached to the front side of the semiconductor wafer above the optically active area of the optical sensor die. An image signal processor (ISP) die processing the raw image signal is embedded in a layer of molding material attached to a back side the semiconductor wafer opposite the front side of the semiconductor wafer.