Stacked Transmissive Optical Sensor Without PCB Support Frame
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Solution Overview
Problem
Conventional transmissive photoelectric sensors have a large size due to the arrangement of the transmitter and receiver on opposite sides of a single printed circuit board and coupled to a support frame.
Innovation Solution
A transmissive optical sensor design where the transmitter and receiver are sequentially stacked with plastic encapsulations, each having a light exit region and photosensitive element, with optically transmissive ends opposing each other, eliminating the need for a PCB and support frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the transmitter and receiver are arranged on opposite sides of a hermetic chamber and coupled to a support frame, then the sensor structure is stable and reliable, but the sensor size becomes large
Solution Approach 1:
The patent merges the transmitter, hermetic chamber, and receiver into a single integrated sensor body. The transmitter and receiver are positioned on opposite sides of the same hermetic chamber that serves as both the protective enclosure and the structural support, eliminating the need for separate support frames and reducing overall sensor size while maintaining structural stability
Solution Approach 2:
The hermetic chamber is designed to serve multiple functions simultaneously: it provides mechanical support for both the transmitter and receiver, maintains the sealed environment for the sensing elements, and defines the optical path between the two components. This multi-functionality reduces the number of separate components needed
2Device complexity
If the transmitter and receiver are arranged on a single PCB board, then the electrical connections are simplified, but the overall sensor size increases due to the support frame requirement
Solution Approach 1:
The patent combines the PCB mounting function directly into the hermetic chamber structure. Electrical connections are made through the chamber walls rather than requiring separate support frame mounting, integrating the electrical connection path with the mechanical structure and eliminating redundant components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces the size of the optical sensor by stacking the transmitter and receiver as plastic encapsulations with flat surfaces, allowing for vertical or horizontal arrangement without additional support structures.
Implementation Method 1
the light-emitting unit defining the light exit region on the first front side, the light-emitting unit embedded in the first plastic encapsulation layer so that at least the light exit region is exposed on the first front side
Implementation Method 2
the second plastic encapsulation having a photosensitive element, the signal exciter having a first optically transmissive end and a second optically transmissive end, which oppose each other, the light exit region aligned with the first optically transmissive end, the photosensitive element aligned with the second optically transmissive end
Data Source
AI summary
A transmissive optical sensor and method of fabricating it are disclosed. The transmissive optical sensor includes a transmitter, a signal exciter and a receiver, which are sequentially stacked together. The transmitter includes first plastic encapsulation, and the receiver includes second plastic encapsulation. The first plastic encapsulation defines a light exit region, the second plastic encapsulation has a photosensitive element. The signal exciter has first and second optically transmissive ends. The light exit region is aligned with the first optically transmissive end, and the photosensitive element with the second optically transmissive end. Both the transmitter and the receiver are provided as plastic encapsulations with flat surfaces, which can be either vertically stacked, or horizontally juxtaposed, with the signal exciter. In this way, it is unnecessary to arrange the transmitter and the receiver on a PCB or couple them with a support frame, significantly reducing the size of the transmissive optical sensor.