Stacked Optoelectronic Chip and Control Element for Scalable Pixel Pitch
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Solution Overview
Problem
Existing active matrix displays face challenges in achieving scalable optoelectronic components with high integration density, limiting the variability of pixel spacing, which is crucial for adaptable and efficient optoelectronic devices.
Innovation Solution
The integration of an optoelectronic semiconductor chip with a control element and connection electrodes, where the semiconductor chip and control element are mechanically and electrically connected, allowing for compact, scalable designs suitable for active matrix displays, with the control element enabling dynamic control of radiation emission or detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the integration density of active components is increased to reduce cost, then manufacturing cost decreases, but pixel spacing variability is reduced
Solution Approach 1:
The invention separates the connection carrier into two distinct parts: a first connection carrier for housing active components and a second connection carrier for mounting optoelectronic components. This segmentation allows independent optimization of each carrier - the first can achieve high integration density for cost reduction while the second can accommodate varying pixel spacing requirements for different applications.
2Productivity
If pixel spacing is reduced to increase integration density, then manufacturing cost decreases, but scalability is limited
Solution Approach 1:
The invention transitions from a single-plane integration approach to a three-dimensional arrangement where active components and optoelectronic components are mounted on separate carriers that can be positioned at different spatial locations. This dimensional change enables high integration density through vertical stacking while maintaining scalability by adjusting the horizontal distance between carriers or the arrangement of component arrays.
3Device complexity
If active components are integrated on a single connection carrier, then device complexity is reduced, but scalability and adaptability are compromised
Solution Approach 1:
The invention creates universal connection carriers that can serve multiple functions: the first connection carrier functions as both a support structure for active components and an electrical interconnection network, while the second connection carrier serves as both an optoelectronic component mount and a scalable pixel array substrate. This multi-functionality allows each carrier to be independently optimized while maintaining overall system simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for high pixel density, low energy consumption, and flexible scalability in optoelectronic devices, such as active matrix displays and micro LED displays, with reduced radiation losses and simplified electrical circuitry.
Implementation Method 1
the optoelectronic semiconductor chip is suitable for emitting electromagnetic radiation, for example in the visible to infrared spectral ranges
Implementation Method 2
the active zone being designed for generating radiation or for receiving radiation
Implementation Method 3
a first and a second connection element for electrically contacting the semiconductor body
Data Source
AI summary
An optoelectronic component includes an optoelectronic semiconductor chip. The optoelectronic component also includes a control element for controlling an electric current and/or an electric voltage of the optoelectronic semiconductor chip. The optoelectronic semiconductor chip and the control element are arranged one above the other and are mechanically and electrically conductively connected to one another. The optoelectronic component further includes a first connection electrode and a second connection electrode for electrically contacting the optoelectronic component from the outside. The optoelectronic semiconductor chip and the control element are each electrically conductively connected to one of the first and second connection electrodes.