Stacked Oscillator Layout for Accurate Temperature Compensation

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Solution Overview

Problem

Existing oscillators face challenges in accurately correcting the frequency of output signals due to temperature differences between the temperature sensor and the resonator element, leading to degraded frequency accuracy.

Innovation Solution

The oscillator design includes a first container with a second container stacked inside, where the resonator element and temperature sensor are accommodated together, and a second circuit element with a frequency control circuit is positioned outside, allowing for precise temperature compensation and improved heat management through insulating and conductive bonding members.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the temperature sensor is placed outside the inner package containing the resonator element, then the device structure is simplified and easier to manufacture, but temperature difference between the sensor and resonator element occurs, degrading frequency accuracy

Engineering Contradiction:

Improveease of manufactureVSAvoidtemperature detection accuracy

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The patent merges the temperature sensor with the inner package structure by providing a recess in the base substrate that accommodates the temperature sensor, and bonding the inner package to the circuit element such that the sensor is positioned adjacent to the resonator element. This combining approach allows the sensor to accurately detect resonator temperature while maintaining manufacturing simplicity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces an insulating bonding member as an intermediary between the inner package and the circuit element. This bonding member serves as a thermal mediator that transfers heat from the resonator element to the temperature sensor while providing electrical insulation, thereby enabling accurate temperature detection without direct electrical connection.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If the second container and second circuit element are stacked, then the oscillator size is reduced, but heat management and stress distribution become more complex

Engineering Contradiction:

Improveoscillator sizeVSAvoidheat management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent segments the oscillator into distinct functional modules: the inner package containing the resonator element and temperature sensor, and the circuit element containing the oscillation and frequency control circuits. This segmentation allows independent optimization of each module for thermal management while achieving compact stacking configuration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by using an insulating bonding member specifically at the interface between the inner package and circuit element. This localized insulating structure manages heat flow in the critical region where the temperature sensor detects resonator temperature, while allowing other regions to have different thermal characteristics for overall heat management.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the accuracy of temperature detection and compensation, resulting in a frequency signal with improved stability and reduced size, while effectively managing heat and stress within the oscillator.

Implementation Method 1

The second container and the second circuit element are stacked and bonded to each other through an insulating bonding member

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

The second circuit element may be bonded to the first base substrate through a conductive bonding member

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

a resonator element accommodated in the second container... an oscillation circuit that causes the resonator element to oscillate so as to generate an oscillation signal

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS10910995B2Oscillator, electronic device, and vehicle

Publication Date: 2021.02.02 SEIKO EPSON CORP

AI summary

An oscillator includes a first container, a second container accommodated in the first container, a resonator element accommodated in the second container, a temperature sensor accommodated in the second container, a first circuit element that is accommodated in the second container and includes an oscillation circuit that causes the resonator element to oscillate so as to generate an oscillation signal on which temperature compensation is performed based on a detected temperature of the temperature sensor, and a second circuit element that is accommodated in the first container and includes a frequency control circuit that controls a frequency of the oscillation signal. The second container and the second circuit element are stacked.