Stacked Semiconductor Package With Overlapping Buffer Chip Layout
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Solution Overview
Problem
Current semiconductor packages face challenges in increasing data processing speed and memory capacity while minimizing the size of the buffer chip, which limits their functionality and efficiency.
Innovation Solution
The semiconductor package design includes a buffer structure with a first redistribution layer, a buffer chip, a second redistribution layer, and a molding layer, along with a chip stack and semiconductor chips, where the buffer chip overlaps the semiconductor chips to enable efficient signal transmission and reception, allowing for improved data processing speed without size constraints on the buffer chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the buffer chip size is reduced to miniaturize the semiconductor package, then the package size is reduced, but the data processing speed and functionality are limited
Solution Approach 1:
The patent transitions from a conventional planar layout where the buffer chip and semiconductor chips are positioned side-by-side to a three-dimensional stacked configuration. The buffer chip is positioned below the semiconductor chips in the vertical dimension, enabling overlapping projections and shorter signal transmission paths. This dimensional change allows the buffer chip to be physically smaller while maintaining or improving data processing speed through reduced transmission distance and enhanced spatial efficiency.
2Device complexity
If the buffer chip size is constrained to match the semiconductor chips, then the package structure is simplified, but the flexibility and adaptability of the design are reduced
Solution Approach 1:
The patent segments the semiconductor package into distinct functional layers: a buffer chip layer and a semiconductor chip layer. This segmentation allows each component to be independently sized and optimized for its specific function. The buffer chip can be smaller than the semiconductor chips above it, as its functional requirements are different. This segmentation enables greater design flexibility and adaptability while maintaining structural organization through the layered architecture.
3Ease of manufacture
If the buffer chip is positioned below the semiconductor chips without overlapping, then the manufacturing process is simpler, but the signal transmission efficiency is reduced
Solution Approach 1:
The patent implements a nested configuration where the buffer chip is positioned below the semiconductor chips such that their projections overlap. This nesting arrangement in the vertical dimension creates shorter and more direct signal transmission paths compared to a side-by-side configuration. The overlapping positioning allows signal traces to travel more efficiently between the buffer chip and semiconductor chips, improving transmission speed while remaining compatible with standard manufacturing processes.
Data Source
AI summary
A semiconductor package including a buffer structure including a first redistribution layer, a first buffer chip on the first redistribution layer, a second redistribution layer on the first buffer chip, and a first molding layer filling between the first redistribution layer and the second redistribution layer, and a first chip stack and a first semiconductor chip on the buffer structure and spaced apart from each other, wherein the first buffer chip overlaps at least a portion of the first semiconductor chip in a first direction from the buffer structure toward the first semiconductor chip, may be provided.