Stacked Semiconductor Package With Continuous Underfill Fillets
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high reliability and low production costs, particularly in stacking highly integrated semiconductor chips, where existing methods often result in interfaces between underfill fillets that compromise adhesion and increase manufacturing complexity.
Innovation Solution
A semiconductor package design featuring underfill fillets that protrude from spaces between semiconductor devices and the package substrate, forming a continuous structure without interfaces, and surrounded by molding resin, which reduces manufacturing time and energy while enhancing adhesion and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If underfill fillets are applied between stacked semiconductor devices, then adhesion and reliability are improved, but interfaces between underfill fillets are created which compromise adhesion and increase manufacturing complexity
Solution Approach 1:
The patent merges multiple separate underfill fillets into a single continuous underfill structure that spans across multiple semiconductor devices. This is achieved by applying underfill material that flows and connects between device interfaces during the molding process, eliminating discrete fillet boundaries and creating a unified adhesive layer that improves reliability while reducing structural complexity.
Solution Approach 2:
The underfill material is applied in a preliminary state before final curing, allowing it to flow and form continuous structures between devices. The material is applied with controlled viscosity characteristics that enable it to bridge gaps and connect interfaces during the molding process, establishing the continuous structure before the material hardens and locks in the configuration.
2Reliability
If multiple underfill fillets are applied between stacked semiconductor devices, then adhesion is improved, but manufacturing time and energy increase
Solution Approach 1:
The patent combines multiple underfill application steps into a single continuous application process. Instead of applying separate underfill fillets between each device interface in sequential steps, the underfill material is applied once and allowed to flow and connect across all interfaces during the molding process, significantly reducing manufacturing time while maintaining adhesion quality.
Solution Approach 2:
The underfill application process is made continuous rather than discontinuous. The material is applied in a continuous flow that simultaneously fills multiple interfaces, and the curing process occurs continuously without interruption. This eliminates the need for multiple discrete application and curing cycles, reducing total manufacturing time while ensuring complete adhesion across all device interfaces.
3Reliability
If interfaces between underfill fillets are eliminated to improve reliability, then adhesion is enhanced, but the underfill structure becomes more complex
Solution Approach 1:
The patent merges multiple discrete underfill fillet shapes into a single continuous underfill structure. The individual fillet shapes that would normally exist between each device interface are combined into one unified structure, eliminating the interfaces between them. This continuous shape provides superior adhesion strength while the complexity is managed through the molding process rather than manual formation of complex geometries.
Data Source
AI summary
A semiconductor package includes a package substrate, a plurality of semiconductor devices stacked on the package substrate, a plurality of underfill fillets disposed between the plurality of semiconductor devices and between the package substrate and the plurality of semiconductor devices, and a molding resin at least partially surrounding the plurality of semiconductor devices and the plurality of underfill fillets. The plurality of underfill fillets include a plurality of protrusions that protrude from spaces between each of the plurality of semiconductor devices or between the package substrate and each of the plurality of semiconductor devices. At least two neighboring underfill fillet protrusions of the plurality of protrusions form one continuous structure without an interface therebetween.