Stacked Semiconductor Package With Vertical Cooling Fins
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Solution Overview
Problem
The challenge of effectively managing heat dissipation in highly integrated semiconductor packages, which are increasingly compact and generate significant heat due to high-capacity data processing, is not adequately addressed by existing technologies.
Innovation Solution
Incorporating a plurality of heat dissipation fins extending vertically from the inactive surface of semiconductor chips within the semiconductor package, with varying lengths and densities to optimize heat emission based on active and dummy areas, thereby enhancing thermal management and integration capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor chips are highly integrated and arranged in a compact semiconductor package to reduce volume, then the volume and weight of electronic parts are reduced, but heat dissipation becomes insufficient due to significant heat generation from high-capacity data processing
Solution Approach 1:
The patent introduces heat dissipation fins that extend vertically in the third dimension (Z-axis) from the inactive surface of the semiconductor chip. This vertical extension increases the heat dissipation surface area without expanding the horizontal footprint of the package, allowing compact integration while effectively managing heat through enhanced thermal radiation and convection surfaces.
Solution Approach 2:
The heat dissipation fins are strategically positioned on the inactive surface of the uppermost semiconductor chip, which is the region that generates significant heat during operation. By concentrating heat dissipation structures where heat generation is highest, the patent optimizes thermal management locally without compromising the compact overall package design.
2Temperature
If multiple heat dissipation fins are arranged in the uppermost semiconductor chip to enhance heat dissipation, then thermal management is improved, but the structural complexity of the semiconductor package increases
Solution Approach 1:
The heat dissipation fins are integrated directly into the inactive surface of the uppermost semiconductor chip substrate, merging the heat dissipation function with the chip structure itself. This integration approach eliminates the need for separate heat dissipation components, reducing overall structural complexity while maintaining effective thermal management.
Solution Approach 2:
The inactive surface of the uppermost semiconductor chip serves dual functions: it acts as a mounting surface for the chip and simultaneously provides the base for heat dissipation fins. This multi-functionality reduces the number of separate components needed, simplifying the overall package structure while achieving both mechanical support and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat dissipation, allowing for efficient arrangement of semiconductor chips in a limited space while maintaining high integration and performance, thus preventing performance degradation due to excessive heat generation.
Implementation Method 1
a second semiconductor chip disposed on the first semiconductor chip. The second semiconductor chip includes a second semiconductor substrate that include an active surface and an inactive surface, and the second semiconductor substrate includes a plurality of isolated heat dissipation fins that extend in a vertical direction from the inactive surface
Data Source
AI summary
A semiconductor package includes a package substrate, a first semiconductor chip mounted on the package substrate and that includes a first semiconductor substrate that includes through electrodes, and a second semiconductor chip disposed on the first semiconductor chip and that includes a second semiconductor substrate that includes an active surface and an inactive surface. The second semiconductor chip further includes a plurality of isolated heat dissipation fins that extend in a vertical direction from the inactive surface.