Stacked Semiconductor Package Assembly With Integrated Cooling Pipe
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Solution Overview
Problem
Existing semiconductor package assemblies face challenges in efficiently dissipating heat generated by high-performance chips, particularly in stacked structures, limiting device performance and functionality.
Innovation Solution
A semiconductor package assembly design where two semiconductor packages are attached face-to-face to opposite sides of a cooling pipe, allowing direct thermal contact between high-performance components and the cooling pipe, with a coolant fluid pathway to efficiently dissipate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat spreader is attached on electronic modules, then heat dissipation is facilitated, but heat dissipation efficiency is still limited for stacked structures
Solution Approach 1:
The cooling pipe is nested within the stacked package structure, with the first package mounted on the lower side and the second package mounted on the upper side of the cooling pipe. This nesting approach allows the cooling pipe to be integrated into the vertical stack, enabling heat dissipation from multiple packages simultaneously without increasing horizontal footprint or overall structural complexity.
Solution Approach 2:
The invention transitions from horizontal heat dissipation (traditional heat spreaders attached on top of packages) to vertical heat dissipation by positioning the cooling pipe in the vertical dimension between stacked packages. This dimensional change allows thermal contact with multiple packages in the vertical stack direction, improving heat dissipation efficiency for 3D stacked architectures.
2Adaptability or versatility
If multiple electronic modules are incorporated in a device, then device functionality is enhanced, but heat generation increases requiring more effective heat dissipation
Solution Approach 1:
The cooling pipe serves multiple functions: it acts as a thermal management component for heat dissipation, provides structural support between stacked packages, and enables vertical interconnection. This multi-functionality allows the same component to address both heat generation from multiple modules and the structural requirements of stacked packaging, supporting enhanced device functionality without proportionally increasing heat dissipation complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation capacity by directly contacting high-performance components with a cooling pipe, improving thermal management and maintaining device performance.
Implementation Method 1
a cooling device including a cooling pipe, wherein the cooling pipe is mounted on the first semiconductor package with a lower surface of the cooling pipe thermally coupled to the first electronic component
Implementation Method 2
a coolant fluid pathway to efficiently dissipate heat
Implementation Method 3
a coolant fluid pathway to efficiently dissipate heat
Data Source
AI summary
A semiconductor package assembly and a method for forming the same are provided. The assembly includes: a first semiconductor package including a first substrate and a first electronic component mounted on a front surface of the first substrate; a cooling device including a cooling pipe, the cooling pipe being mounted on the first semiconductor package with a lower surface of the cooling pipe thermally coupled to the first electronic component; a second semiconductor package including a second substrate and a second electronic component mounted on a front surface of the second substrate, the second semiconductor package being mounted on the cooling pipe with the second electronic component thermally coupled to an upper surface of the cooling pipe; an encapsulant formed between the front surface of the first substrate and the front surface of the second substrate to encapsulate the first, second electronic components, and a portion of the cooling pipe.