Stacked Semiconductor Package Layout for Stable Corner Interconnects
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Solution Overview
Problem
The increasing integration of chips in stacked semiconductor packages leads to issues with structural stability and defects due to the increased number of solder bumps, which can cause electrical shorts and mechanical instability.
Innovation Solution
A semiconductor package design featuring a first die with signal and peripheral regions, where connection terminals are denser on the peripheral regions adjacent to corners and less dense on lateral surfaces, and an under-fill process that prevents excessive protrusion onto lateral surfaces, ensuring improved structural stability and reduced defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of solder bumps is increased to achieve higher chip integration, then the integration capability is improved, but the structural stability deteriorates and defects increase
Solution Approach 1:
The patent applies local quality by differentiating the connection terminal density across different peripheral regions. Corner regions have higher connection terminal density while lateral surface regions have lower density, optimizing both structural stability and integration capability in different locations rather than using uniform distribution throughout the die.
2Productivity
If the number of solder bumps is increased to achieve higher chip integration, then the integration capability is improved, but the occurrence of defects such as electrical shorts increases
Solution Approach 1:
The patent implements local quality by varying connection terminal density across different peripheral regions. Corner regions with higher connection terminal density provide enhanced reliability, while lateral surface regions with lower density reduce the overall defect occurrence, thus improving integration capability while controlling defect rates.
3Ease of manufacture
If connection terminals are uniformly distributed on the peripheral region, then the manufacturing process is simplified, but the structural stability deteriorates
Solution Approach 1:
The patent applies local quality by differentiating connection terminal density between corner regions and lateral surface regions. This non-uniform distribution enhances structural stability in corner regions while maintaining manufacturing feasibility through defined regional patterns, resolving the contradiction between manufacturing simplicity and structural stability.
Solution Approach 2:
The patent segments the peripheral region into distinct zones: corner regions with higher connection terminal density and lateral surface regions with lower density. This segmentation allows optimized structural stability in critical corner areas while maintaining overall manufacturing feasibility through systematic regional differentiation.
Data Source
AI summary
Disclosed are semiconductor packages and their fabricating methods. The semiconductor package comprises connection terminals between a first die and a second die. The first die has signal and peripheral regions and includes first vias on the peripheral region. The second die is on the first die and has second vias on positions that correspond to the first vias. The connection terminals connect the second vias to the first vias. The peripheral region includes first regions adjacent to corners of the first die and second regions adjacent to lateral surfaces of the first die. The connection terminals include first connection terminals on the first regions and second connection terminals on the second regions. A sum of areas of the first connection terminals per unit area on the first regions is greater than that of areas of the second connection terminals per unit area on the second regions.