Stacked Semiconductor Package With Isolated Dual-Chamber Stimulus Paths

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.

Innovation Solution

The development of semiconductor devices with a stacked substrate configuration and integrated housing that provide isolated passages for stimuli communication, using a universal housing instead of dedicated molding systems, allowing for a smaller form factor and reduced manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional semiconductor packages are used, then manufacturing processes are established, but package sizes are too large and costs are excessive

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The semiconductor package is divided into multiple stacked substrates (first substrate, second substrate, third substrate) that are vertically arranged and interconnected. This segmentation allows each substrate to be optimized independently while achieving a compact overall structure, directly reducing package size while maintaining manufacturability through modular assembly processes

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package architecture transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. By arranging substrates vertically in multiple layers and using through-substrate vias for interconnection, the design achieves higher integration density in the vertical dimension, significantly reducing the horizontal footprint and overall package volume

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If traditional semiconductor packages are used, then standard packaging is achieved, but reliability is decreased

Engineering Contradiction:

Improvepackage reliabilityVSAvoidpackage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent incorporates dedicated stress relief structures and compliant interconnect elements within the stacked substrate architecture that preemptively accommodate thermal expansion differences and mechanical stresses before they cause failure. These features are built into the structure during manufacturing, providing inherent reliability protection against common package failure modes

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

Multiple functional elements are merged into integrated structures within the stacked substrate design. The housing, substrates, and interconnect structures are combined into a unified three-dimensional assembly where structural components serve multiple functions (mechanical support, electrical interconnection, and stress management), improving reliability while the integrated nature reduces the number of discrete parts

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If dedicated molding systems are used, then specific package requirements are met, but manufacturing costs increase

Engineering Contradiction:

Improvemanufacturing costVSAvoidhousing universality

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The housing is designed as a universal component that can accommodate multiple different sensor types and configurations within the same package platform. The standardized housing interface and modular substrate architecture allow a single housing design to serve multiple product variants, eliminating the need for dedicated molding systems for each application and significantly reducing tooling costs while maintaining adaptability

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12480828B2Electronic devices and methods of manufacturing electronic devices

Publication Date: 2025.11.25 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device includes a substrate structure and a housing. The housing is coupled to the substrate structure and includes a first chamber, a second chamber isolated from the first chamber, a first port comprising a first passage coupled to the first chamber, and a second port comprising a second passage coupled to the second chamber. An electronic component within the first chamber and includes a top side and a lower side opposite to the top side and isolated from the top side. The top side of the electronic component is configured to receive a first stimulus through the first passage and the first chamber, and the lower side of the electronic component is configured to receive a second stimulus through the second passage and the second chamber. Other examples and related methods are also disclosed herein.