Stacked Semiconductor Package With Dummy Chip Thermal Path
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in reducing size and weight while improving warpage, heat-dissipation, and electrical characteristics, especially in integrating multiple components into a single compact package.
Innovation Solution
A semiconductor package design that includes a semiconductor chip, a dummy chip with penetration electrodes, and protection layers, where the dummy chip is bonded to the semiconductor chip using a hybrid bonding process, enhancing heat dissipation through the electrodes and improving structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a plurality of semiconductor chips are integrated in a single package, then the functional performance and heat dissipation are improved, but the package size and weight increase
Solution Approach 1:
The package is divided into functional semiconductor chips and dummy chips with different functions. The dummy chips serve as heat dissipation structures and structural support elements, separating the functional components from the thermal management components, thereby reducing the overall package weight while maintaining heat dissipation efficiency
Solution Approach 2:
Different regions of the package are assigned different properties: functional chips for electronic operations, dummy chips for heat dissipation and structural support, and penetration electrodes for thermal conduction. This localized functional differentiation optimizes the weight-to-performance ratio by giving each component its specific role
2Volume of moving object
If the package size is reduced, then the compactness is improved, but the heat dissipation efficiency deteriorates
Solution Approach 1:
Heat dissipation is achieved not only through planar expansion but also through vertical penetration electrodes that conduct heat from the semiconductor chips through the dummy chips to the package substrate. This three-dimensional heat conduction path enables effective thermal management in a compact volume
Solution Approach 2:
Dummy chips with penetration electrodes serve as intermediary structures between the heat-generating semiconductor chips and the package substrate. These intermediaries provide dedicated thermal conduction paths that maintain heat dissipation efficiency even when the overall package size is reduced
3Device complexity
If multiple components are integrated in a single package, then the component count is reduced, but the warpage and structural stability worsen
Solution Approach 1:
Dummy chips are made from the same semiconductor material as the functional chips, ensuring homogeneous material properties and thermal expansion characteristics throughout the package. This material homogeneity reduces differential stress and warpage while maintaining structural integrity
Solution Approach 2:
The package employs a composite structure combining functional semiconductor chips, dummy chips with penetration electrodes, and protective layers. This composite architecture provides both mechanical strength and thermal management capabilities, enhancing overall structural stability
4Temperature
If penetration electrodes are added to dummy chips, then the heat dissipation is improved, but the manufacturing complexity increases
Solution Approach 1:
Penetration electrodes are formed in the dummy chips during the chip fabrication process before the chips are mounted in the package. This preliminary formation of thermal conduction paths simplifies the overall manufacturing process by integrating heat dissipation structures into the chip fabrication rather than adding them separately during package assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances heat dissipation and structural stability, allowing for more efficient heat transfer and improved performance in compact electronic devices.
Implementation Method 1
enhancing heat dissipation through the electrodes and improving structural stability
Data Source
AI summary
According to embodiments of the present disclosure, a semiconductor package is provided and may include: a substrate; a semiconductor chip on the substrate; a dummy chip on the semiconductor chip; and a first protection layer between the semiconductor chip and the dummy chip. The dummy chip may include: a semiconductor substrate including a first surface and a second surface, opposite to the first surface, the first surface being closer than the second surface to the semiconductor chip; a second protection layer on the first surface; and at least one penetration electrode penetrating the semiconductor substrate and the second protection layer. The at least one penetration electrode may be spaced apart from the semiconductor chip in a first direction perpendicular to a top surface of the semiconductor chip, and the first protection layer may be in contact with the second protection layer.