Stacked Semiconductor Package With Flexible Connection Films
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Solution Overview
Problem
Semiconductor packages face limitations in achieving finer pitch and reduced thickness due to the shape of bonding wires, such as ball size and wire loop height, which hinder the implementation of higher performance and miniaturization.
Innovation Solution
The use of flexible connection films and conductive lines on a substrate, along with connection bumps, to form electrical connections between semiconductor chips and bonding pads, allowing for a miniaturized and reliable semiconductor package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If bonding wires are used to connect semiconductor chips to substrate, then electrical connections can be established, but the pitch and thickness of connection pads are limited due to ball size and wire loop height
Solution Approach 1:
The patent replaces traditional bonding wires with flexible connection films that have a thin profile. These films can be bent and routed to connect semiconductor chips to the substrate without requiring the ball size and loop height constraints of wire bonding, thereby enabling finer pitch and reduced thickness of connection pads.
Solution Approach 2:
The patent substitutes the mechanical wire bonding system with a film-based connection system. Instead of using metal wires that require mechanical ball formation and looping, the invention uses flexible films with conductive patterns that can be directly routed and connected, eliminating the mechanical constraints of wire bonding geometry.
2Productivity
If traditional wire bonding is used, then electrical connections are achieved, but manufacturing complexity and time are increased
Solution Approach 1:
The connection films are prepared and configured before the semiconductor chips are mounted on the substrate. The films are pre-routed and positioned, allowing for simplified assembly where chips are simply placed and connected, rather than requiring complex wire bonding operations during the assembly process.
Solution Approach 2:
The patent combines the connection function with the packaging structure by integrating connection films into the mold compound or substrate structure. This merging of connection and packaging functions reduces the number of separate manufacturing steps and simplifies the overall process.
Data Source
AI summary
A semiconductor package includes a substrate including bonding pads, semiconductor chips stacked on the substrate and each including a lower surface and an upper surface, and connection pads on the upper surface, connection films spaced apart from each other in a first direction, the connection films electrically connecting the connection pads and corresponding ones of the bonding pads to each other in a second direction intersecting the first direction, a mold covering the semiconductor chips and the connection films, and connection bumps being under the substrate, the connection bumps electrically connected to the bonding pads. Each of the connection films includes a flexible film covering at least two connection pads adjacent to each other in the first direction, among the connection pads, and conductive lines extending in the second direction on the flexible film, the conductive lines respectively connected to the at least two connection pads.