Stacked Semiconductor Package Structure With Gap Cooling
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Solution Overview
Problem
The electronics industry faces challenges in integrating more circuits while reducing size, enhancing performance, and improving functionality, requiring innovative semiconductor package structures that are lighter, faster, smaller, more reliable, and cost-effective.
Innovation Solution
A semiconductor package structure is developed, featuring a chip stacking structure with a molding compound and a conductive block that connects independent package structures, allowing for reduced height, independent testing, and increased heat dissipation efficiency by forming a gap between the structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a chip stacking structure with molding compound is used to integrate more circuits, then circuit integration and functionality are improved, but package height and heat dissipation become problematic
Solution Approach 1:
The patent implements a package-on-package structure where a second package structure is disposed on top of the first package structure, with one package nested within the vertical space of another. This nesting approach enables higher circuit integration density while managing package height through efficient vertical stacking rather than horizontal expansion.
Solution Approach 2:
The invention transitions from two-dimensional planar packaging to three-dimensional vertical packaging by stacking multiple package structures vertically. This dimensional change allows circuits to be integrated in the vertical dimension (Z-axis), achieving higher integration without proportionally increasing overall package height, as the stacking utilizes unused vertical space.
2Volume of moving object
If package structures are closely integrated to reduce size, then miniaturization is achieved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent divides the integrated package into separate first and second package structures with distinct functional regions. This segmentation allows independent heat management for each package, enabling targeted thermal solutions and preventing heat accumulation that would occur in tightly coupled monolithic structures, thus improving overall heat dissipation efficiency while maintaining compact size.
Solution Approach 2:
The invention introduces an intermediary gap structure between the first and second package structures. This gap acts as a thermal management interface that facilitates heat dissipation pathways, allowing heat from densely integrated circuits to be efficiently conducted away without requiring increased package volume, thereby resolving the contradiction between miniaturization and heat dissipation.
3Reliability
If additional intermediary structures are added to connect package structures, then electrical connection is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the electrical connection function with the mechanical support structure by integrating conductive elements directly into the package substrate and interconnection layers. This consolidation eliminates the need for separate intermediary connection structures, reducing device complexity while maintaining reliable electrical connections between stacked packages through the unified structural design.
Solution Approach 2:
The invention designs the package substrate and interconnection structures to serve multiple functions simultaneously: providing mechanical support, enabling electrical connections, and facilitating thermal management. This multi-functionality reduces the number of dedicated intermediary structures needed, simplifying the overall device architecture while ensuring reliable electrical connectivity between package structures.
4Productivity
If more circuits are integrated in smaller space, then productivity and functionality are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements preliminary alignment features during the package fabrication process, such as pre-formed conductive patterns, alignment marks, and standardized substrate geometries. These preliminary actions establish precise reference frames before final assembly, enabling high-precision alignment of stacked packages without requiring excessive manufacturing precision during the critical bonding stage, thus facilitating higher circuit integration density.
Data Source
AI summary
A semiconductor package structure includes a first package structure and a second package structure. The first package structure includes a chip stacking structure and a molding compound. A first conductive block is disposed on the chip stacking structure. The molding compound wraps the chip stacking structure and exposes the first conductive block. The second package structure is disposed on the chip stacking structure and electrically connected to the first conductive block. A gap is formed between the first package structure and the second package structure.