Stacked Semiconductor Package Gap-Fill Structure for Flatness Stability
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved process stability, particularly when stacking multiple semiconductor chips, which can lead to issues with flatness and the effectiveness of gap fill films.
Innovation Solution
The semiconductor package incorporates a multiple gap fill film structure that includes an inorganic filling film and an organic filling film sequentially stacked on a liner film, extending along the upper side of the first semiconductor chip and the side faces of the second and third semiconductor chips, to enhance flatness and process stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips are stacked to increase capacity, then the capacity and multifunction of the semiconductor package are improved, but the flatness and process stability deteriorate
Solution Approach 1:
A gap fill film is introduced as an intermediary material between stacked semiconductor chips to fill the gaps and uneven surfaces. This mediator layer compensates for height differences and surface irregularities, enabling subsequent planarization processes to achieve the required flatness while maintaining the multi-chip stacking configuration that provides high capacity
Solution Approach 2:
The viscosity of the gap fill material is carefully controlled and optimized. By adjusting the viscosity parameter of the gap fill film, the material can effectively flow into and fill gaps between chips during the filling process, then maintain its shape and provide stable planarization support, thereby achieving both good flatness and process stability
2Manufacturing precision
If gap fill films are used to improve flatness, then the manufacturing precision is improved, but the process complexity increases
Solution Approach 1:
The gap fill film is designed as a composite structure with specific material properties. The composite nature of the gap fill material provides both gap-filling capability and planarization support, achieving improved flatness while the material's inherent properties reduce the need for additional complex process steps
Data Source
AI summary
A semiconductor package includes a first semiconductor chip, which includes a first semiconductor substrate and a first bonding layer on the first semiconductor substrate. A second semiconductor chip includes a second semiconductor substrate, a second bonding layer bonded to the first bonding layer, and a chip-through-via which penetrates the second semiconductor substrate and is connected to the second bonding layer. A passivation film extends along an upper side of the second semiconductor chip and does not extend along side-faces of the second semiconductor chip. The chip-through-via penetrates the passivation film. A multiple-gap-fill film extends along the upper side of the first semiconductor chip, the side faces of the second semiconductor chip, and the side faces of the passivation film. The multiple-gap-fill films includes an inorganic filling film and an organic filling film which are sequentially stacked on the first semiconductor chip.