Stacked Semiconductor Package With Heat-Bypass Electrode Layout

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

In semiconductor packages with densely disposed through-electrodes, hotspots form due to high-speed communication, leading to increased thermal resistance and performance deterioration.

Innovation Solution

A semiconductor package design incorporating a dummy chip with a cool zone between the first and second semiconductor chips, along with a thermal barrier layer, to redirect heat flow and reduce temperature in the hot zones, thereby improving heat dissipation and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If through electrodes are densely disposed to enable high-speed communication in stacked semiconductor chips, then communication performance is improved, but hotspots are formed leading to temperature increase and performance deterioration

Engineering Contradiction:

Improvecommunication speedVSAvoidhotspot temperature

Core Design Contradiction:

SpeedVSTemperature

Solution Approach 1:

A dummy chip is introduced as an intermediary component between the first and second semiconductor chips. This dummy chip includes a cool zone that acts as a thermal barrier, intercepting heat flow from the first hot zone before it reaches the second hot zone. The dummy chip serves as a mediator that redirects heat pathways without interfering with the electrical connection between through electrodes, thus maintaining communication performance while reducing hotspot temperatures.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The stacking structure is segmented by inserting a dummy chip with distinct functional zones (cool zone) between the active semiconductor chips. This segmentation divides the thermal pathways, creating separate heat management regions. The cool zone in the dummy chip segments the direct vertical heat flow, forcing heat to bypass through alternative pathways that do not concentrate in the second hot zone, thereby reducing temperature accumulation.

Inventive Principle:

Principle #1Segmentation

2Temperature

If a dummy chip with cool zone is inserted between semiconductor chips to reduce hotspot temperature, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:

Improvehotspot temperatureVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The dummy chip is designed to perform multiple functions simultaneously: it provides electrical connection continuity through its through electrodes, creates thermal management zones (cool zone) to redirect heat flow, and maintains mechanical support for the stacked structure. By making the dummy chip multi-functional, the need for separate dedicated thermal management components is eliminated, thus reducing overall device complexity while achieving heat dissipation improvement.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The electrical connection function and thermal management function are merged into a single dummy chip component. The through electrodes of the dummy chip serve both to conduct electricity between chips and to define thermal pathways through their positioning. The cool zone is integrated within the dummy chip structure rather than being a separate component, combining multiple functions into one element to minimize structural complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively disperses heat from the hot zones to surrounding regions, enhancing thermal dissipation properties and reliability of the semiconductor package by preventing temperature rise in the second semiconductor chips.

Implementation Method 1

a first thermal barrier layer disposed between the first hot zone and the cool zone

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 2

first heat redistribution through electrodes disposed outside of an outer boundary of the cool zone and electrically connected to the first through electrodes

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12199002B2Semiconductor package and method of manufacturing the same

Publication Date: 2025.01.14 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a first semiconductor chip including first through electrodes and having a first hot zone in which the first through electrodes are disposed; a heat redistribution chip disposed on the first semiconductor chip, having a cool zone overlapping the first hot zone in a stacking direction with respect to the first semiconductor chip, and including first heat redistribution through electrodes disposed outside of an outer boundary of the cool zone and electrically connected to the first through electrodes, respectively; a second semiconductor chip disposed on the heat redistribution chip, having a second hot zone overlapping the cool zone in the stacking direction, and including second through electrodes disposed in the second hot zone and electrically connected to the first heat redistribution through electrodes, respectively; and a first thermal barrier layer disposed between the first hot zone and the cool zone, wherein the first through electrodes are electrically connected to the second through electrodes by bypassing the cool zone via the first heat redistribution through electrodes.