Multi-stacked Semiconductor Package Heat Release Column
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Solution Overview
Problem
As the number of stacked semiconductor packages or printed circuit boards increases, heat accumulation leads to reduced mechanical and operational reliability, necessitating an efficient heat release method.
Innovation Solution
A multi-stacked structure of semiconductor packages with a heat release column extending through multiple substrates, thermally connected to a heat dissipation part, which includes a metal column, heat pipe, or thermal electric cooler, positioned to directly absorb heat from the maximum heat generation package and dissipate it through a thermal conductive adhesive and heat dissipation plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the stacked number of semiconductor packages or PCBs is increased to achieve high integration, then the functionality and integration density are improved, but heat accumulates which reduces mechanical and operational reliability
Solution Approach 1:
The patent transitions from planar heat dissipation to vertical three-dimensional heat dissipation by extending heat release columns through multiple stacked substrates. This allows heat to be conducted vertically across layers rather than relying solely on lateral dissipation, enabling effective heat management in high-density stacked configurations while maintaining reliability.
Solution Approach 2:
The patent introduces heat release columns as intermediary thermal conduction paths between heat-generating semiconductor packages and heat dissipation structures. These columns act as thermal mediators that efficiently transfer heat from internal packages to external dissipation points, resolving the heat accumulation problem without compromising the stacked structure's integrity.
2Productivity
If more substrates are stacked vertically to increase integration, then the functional capacity is improved, but thermal resistance increases and heat dissipation becomes less efficient
Solution Approach 1:
The patent divides the thermal management system into segmented heat release columns distributed across multiple substrates. Each column serves as an independent thermal conduction path, allowing heat to be dissipated from different locations and depths within the stacked structure, thereby reducing overall thermal resistance despite increased vertical stacking.
Solution Approach 2:
The patent employs composite thermal management structures combining heat release columns made of thermally conductive materials (such as metal columns, heat pipes, or thermal electric coolers) with the substrate materials. This composite approach enhances thermal conductivity through the stacked layers, counteracting the increased thermal resistance that would normally result from multiple interfaces and layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances mechanical and operational reliability by effectively managing heat dissipation across multiple substrates, improving thermal conductivity and reducing thermal resistance, thereby maintaining the performance and integrity of the stacked structure.
Implementation Method 1
a heat release column extending commonly through the plurality of the substrates... a heat dissipation part thermally connected to one end of the heat release column
Implementation Method 2
a thermal conductive adhesive interposed between a bottom of the heat release column and the top surface of the one of the ground wirings
Implementation Method 3
the heat release column may include a metal column, a heat pipe and/or a thermal electric cooler (TEC)
Implementation Method 4
the heat release column may include a metal column, a heat pipe and/or a thermal electric cooler (TEC)
Data Source
AI summary
A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.